Overview
- Editors:
-
-
E. Beyne
-
IMEC, Leuven, Belgium
-
C. J. M. Lasance
-
Philips B.V., Eindhoven, The Netherlands
-
J. Berghmans
-
Catholic University Leuven, Leuven, Belgium
Access this book
Other ways to access
Table of contents (34 papers)
-
Thermal Characterisation
-
-
- Valter Motta, Claudio M. Villa, Tiao Zhou
Pages 187-194
-
- Areski Belache, Thierry Gautier, Jean Claude Boisde, Nicolas Leveau, Guy Paulet
Pages 195-201
-
- D. Petitjean, P. Lybaert, E. Filippi, A. Sturbois
Pages 203-212
-
Single and Multi-Phase Convective Cooling
-
Front Matter
Pages 213-213
-
-
-
- A. Aranyosi, L. Bolle, H. Buyse
Pages 243-252
-
- G. Cesini, V. Moro, R. Ricci, E. Fumi
Pages 253-261
-
- R. A. van Es, R. M. Noort, C. J. M. Lasance
Pages 263-272
-
-
Measurement Techniques
-
Front Matter
Pages 281-281
-
- Oronzio Manca, Biagio Morrone, Sergio Nardini
Pages 283-292
-
-
- E. R. Meinders, T. H. Vd Meer, C. J. Hoogendoorn, C. J. M. Lasance
Pages 301-308
-
- J. Hennissen, W. Temmerman, J. Berghmans, K. Allaert
Pages 309-318
-
Thermomechanical Modelling
-
Front Matter
Pages 319-319
-
- L. Tielemans, G. Gregoris, L. de Schepper, M. D’Olieslaeghers
Pages 321-328
-
-
- F. Christiaens, E. Beyne, J. Roggen, J. van Puymbroeck, M. Heerman
Pages 339-348
About this book
For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.
Editors and Affiliations
-
IMEC, Leuven, Belgium
E. Beyne
-
Philips B.V., Eindhoven, The Netherlands
C. J. M. Lasance
-
Catholic University Leuven, Leuven, Belgium
J. Berghmans