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Nanopackaging

Nanotechnologies and Electronics Packaging

  • Book
  • © 2008

Overview

Editors:
  1. James E. Morris

    1. Dept. Electrical &, Computer Engineering, Portland State University, Portland, USA

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  • Offers a comprehensive discussion of Nanoparticles and Carbon Nanotubes, and how and why they are rapidly becoming materials options for electronics packaging
  • Discusses the importance of computer modeling in nanopackaging and offers suggestions for implementation
  • Discusses Nanoparticles and their role in packaging, including basic properties and fabrication, and applications in resistors, capacitors, inductors, microvias and conductive adhesives, solder, underfill, and thermal management
  • Discusses Carbon Nanotubes and their role in packaging, including basic properties and fabrication, and applications in solder, thermal management, and EMI control
  • Brings together a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends
  • Includes supplementary material: sn.pub/extras

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Table of contents (24 chapters)

  1. Nanowires in Electronics Packaging

    • Stefan Fielder, Michael Zwanzig, Ralf Schmidt, Wolfgang Scheel
    Pages 441-463

  2. Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging

    • Lunyu Ma, Suresh K. Sitaraman, Qi Zhu, Kevin Klein, David Fork
    Pages 465-490

  3. Flip Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities

    • Debendra Mallik, Ravi Mahajan, Vijay Wakharkar
    Pages 491-516

  4. Nanoelectronics Landscape: Application, Technology, and Economy

    • G. Q. Zhang
    Pages 517-535

  5. Errata

    • James E. Morris
    Pages E1-E6

  6. Back Matter

    Pages 537-543
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Keywords

About this book

Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement. “Nanopackaging” is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in nanotechnology. It will survey the application of nanotechnologies to electronics packaging, as represented by current research across the field.

Reviews

From the reviews: “This is an impressive work that provides a substantial and relatively in depth coverage of a wide range of electronics packaging and assembly related applications for nanotechnology. Each chapter concludes with a list of references that can be used by the reader to further investigate a particular subject and the book is well produced with good quality figures and illustrations. … I am pleased to be able to conclude this … Nanopackaging: Nanotechnologies and Electronics Packaging as ‘highly recommended’.” (Martin Goosey, Microelectronics International, Vol. 26 (3), 2009)

Editors and Affiliations

  • Dept. Electrical &, Computer Engineering, Portland State University, Portland, USA

    James E. Morris

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