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Semiconductor Advanced Packaging

  • Book
  • © 2021

Overview

Authors:
  1. John H. Lau

    1. Unimicron Technology Corporation, Taoyuan, Taiwan

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  • Addresses advanced semiconductor packaging both in theory and practice
  • Comprehensively studies design, materials, process, fabrication, and reliability of various advanced semiconductor packaging technologies
  • Provides in-depth treatment of packaging technologies

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Table of contents (11 chapters)

  1. Front Matter

    Pages i-xxii
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  2. Advanced Packaging

    • John H. Lau
    Pages 1-25

  3. System-in-Package (SiP)

    • John H. Lau
    Pages 27-74

  4. Fan-In Wafer/Panel-Level Chip-Scale Packages

    • John H. Lau
    Pages 75-146

  5. Fan-Out Wafer/Panel-Level Packaging

    • John H. Lau
    Pages 147-237

  6. 2D, 2.1D, and 2.3D IC Integration

    • John H. Lau
    Pages 239-298

  7. 2.5D IC Integration

    • John H. Lau
    Pages 299-342

  8. 3D IC Integration and 3D IC Packaging

    • John H. Lau
    Pages 343-378

  9. Hybrid Bonding

    • John H. Lau
    Pages 379-411

  10. Chiplet Heterogeneous Integration

    • John H. Lau
    Pages 413-439

  11. Low Loss Dielectric Materials

    • John H. Lau
    Pages 441-463

  12. Advanced Packaging Trends

    • John H. Lau
    Pages 465-489

  13. Back Matter

    Pages 491-498
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Keywords

About this book

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Authors and Affiliations

  • Unimicron Technology Corporation, Taoyuan, Taiwan

    John H. Lau

About the author

John H. Lau, Ph.D., P.E. has been the CTO of Unimicron in Taiwan since August 2019. Prior to that, he was a Senior Technical Advisor at ASM Pacific Technology in Hong Kong for 5 years; a specialist of the Industrial Technology Research Institute in Taiwan for 4½ years and a Senior Scientist/MTS at Hewlett-Packard Laboratory/Agilent in California for more than 25 years. He earrned a Ph.D. degree in theoretical and applied mechanics from the University of Illinois at Urbana–Champaign.With more than 40 years of R&D and manufacturing experience, he has authored or coauthored more than 480 peer-reviewed technical publications, invented more than 30 issued or pending US patents, and given more than 300 lectures/workshops/keynotes worldwide. He has authored or coauthored 20 textbooks on fan-out wafer-level packaging, 3D IC heterogeneous integration and packaging, TSV for 3D integration, advanced MEMS packaging, reliability of 2D and 3D IC interconnects, flip chip, WLP, MCM, area-array packages, WLCSP, high-density PCB, SMT, DCA, TAB, lead-free materials, soldering, manufacturing, and solder joint reliability.

He has received many awards from the American Society of Mechanical Engineers (ASME), the Institute of Electrical and Electronics Engineers (IEEE), the Society of Manufacturing Engineers (SME) and other societies. He is an elected ASME fellow, IEEE fellow, and IMAPS fellow, and has been heavily involved in many of ASME’s, IEEE’s, and IMAPS’ technical activities.

Bibliographic Information

  • Book Title: Semiconductor Advanced Packaging

  • Authors: John H. Lau

  • DOI: https://doi.org/10.1007/978-981-16-1376-0

  • Publisher: Springer Singapore

  • eBook Packages: Engineering, Engineering (R0)

  • Copyright Information: The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd. 2021

  • Hardcover ISBN: 978-981-16-1375-3Published: 18 May 2021

  • Softcover ISBN: 978-981-16-1378-4Published: 19 May 2022

  • eBook ISBN: 978-981-16-1376-0Published: 17 May 2021

  • Edition Number: 1

  • Number of Pages: XXII, 498

  • Number of Illustrations: 27 b/w illustrations, 530 illustrations in colour

  • Topics: Electronics and Microelectronics, Instrumentation, Semiconductors, Industrial and Production Engineering

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