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Nato Science Partnership Subseries: 3

Microelectronic Interconnections and Assembly

Editors: Harman, G.G., Mach, Pavel (Eds.)

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MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.

Table of contents (31 chapters)

Table of contents (31 chapters)

Buy this book

eBook $59.99
price for USA in USD (gross)
  • ISBN 978-94-011-5135-1
  • Digitally watermarked, DRM-free
  • Included format: PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Softcover $79.99
price for USA in USD
  • ISBN 978-94-010-6159-9
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
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Bibliographic Information

Bibliographic Information
Book Title
Microelectronic Interconnections and Assembly
Editors
  • G.G. Harman
  • Pavel Mach
Series Title
Nato Science Partnership Subseries: 3
Series Volume
54
Copyright
1998
Publisher
Springer Netherlands
Copyright Holder
Springer Science+Business Media Dordrecht
eBook ISBN
978-94-011-5135-1
DOI
10.1007/978-94-011-5135-1
Softcover ISBN
978-94-010-6159-9
Series ISSN
1388-6576
Edition Number
1
Number of Pages
XIV, 299
Topics