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Table of contents (31 chapters)
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Front Matter
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Packaging and Interconnection Trends - Present and Future
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Solder and Flip Chip Interconnections and Assembly
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Single Chip Interconnection and Qualification: Wire Bonding and TAB
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Multichip Module Interconnections and Assembly I
About this book
Editors and Affiliations
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Semiconductor Electronics Division, National Institute of Standards and Technology, Gaithersburg, USA
George Harman
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Department of Electrotechnology, Czech Technical University in Prague, Prague, Czech Republic
Pavel Mach
Bibliographic Information
Book Title: Microelectronic Interconnections and Assembly
Editors: George Harman, Pavel Mach
Series Title: NATO Science Partnership Subseries: 3
DOI: https://doi.org/10.1007/978-94-011-5135-1
Publisher: Springer Dordrecht
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eBook Packages: Springer Book Archive
Copyright Information: Springer Science+Business Media Dordrecht 1998
Hardcover ISBN: 978-0-7923-5139-9Published: 31 August 1998
Softcover ISBN: 978-94-010-6159-9Published: 05 November 2012
eBook ISBN: 978-94-011-5135-1Published: 06 December 2012
Series ISSN: 1388-6576
Edition Number: 1
Number of Pages: XIV, 299
Topics: Manufacturing, Machines, Tools, Processes, Metallic Materials, Optical and Electronic Materials, Characterization and Evaluation of Materials, Electrical Engineering