Springer Theses

Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces

Authors: Zhang, Qingke

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  • Nominated by the Chinese Academy of Sciences as an outstanding thesis in the field
  • Illustrates the damage behavior of a series of Pb-free solder joints under different loading conditions
  • In-situ characterization techniques are used to reveal the dynamic damage process in solder joints
  • The fracture behavior and fracture strength of the Cu-Sn intermetallic compound are tested
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eBook $89.00
price for USA in USD
  • ISBN 978-3-662-48823-2
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  • Included format: PDF, EPUB
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Hardcover $129.00
price for USA in USD
  • ISBN 978-3-662-48821-8
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  • Covid-19 shipping restrictions & severe weather in the US may cause delays
  • Usually ready to be dispatched within 3 to 5 business days, if in stock
Softcover $119.99
price for USA in USD
  • ISBN 978-3-662-51725-3
  • Free shipping for individuals worldwide
  • Institutional customers should get in touch with their account manager
  • Covid-19 shipping restrictions & severe weather in the US may cause delays
  • Usually ready to be dispatched within 3 to 5 business days, if in stock
About this book

This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.

Table of contents (6 chapters)

Table of contents (6 chapters)

Buy this book

eBook $89.00
price for USA in USD
  • ISBN 978-3-662-48823-2
  • Digitally watermarked, DRM-free
  • Included format: PDF, EPUB
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $129.00
price for USA in USD
  • ISBN 978-3-662-48821-8
  • Free shipping for individuals worldwide
  • Institutional customers should get in touch with their account manager
  • Covid-19 shipping restrictions & severe weather in the US may cause delays
  • Usually ready to be dispatched within 3 to 5 business days, if in stock
Softcover $119.99
price for USA in USD
  • ISBN 978-3-662-51725-3
  • Free shipping for individuals worldwide
  • Institutional customers should get in touch with their account manager
  • Covid-19 shipping restrictions & severe weather in the US may cause delays
  • Usually ready to be dispatched within 3 to 5 business days, if in stock
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Bibliographic Information

Bibliographic Information
Book Title
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
Authors
Series Title
Springer Theses
Copyright
2016
Publisher
Springer-Verlag Berlin Heidelberg
Copyright Holder
Springer-Verlag Berlin Heidelberg
eBook ISBN
978-3-662-48823-2
DOI
10.1007/978-3-662-48823-2
Hardcover ISBN
978-3-662-48821-8
Softcover ISBN
978-3-662-51725-3
Series ISSN
2190-5053
Edition Number
1
Number of Pages
XV, 143
Number of Illustrations
34 b/w illustrations, 81 illustrations in colour
Topics