Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
Authors: Zhang, Qingke
Free Preview- Nominated by the Chinese Academy of Sciences as an outstanding thesis in the field
- Illustrates the damage behavior of a series of Pb-free solder joints under different loading conditions
- In-situ characterization techniques are used to reveal the dynamic damage process in solder joints
- The fracture behavior and fracture strength of the Cu-Sn intermetallic compound are tested
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- About this book
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This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.
- Table of contents (6 chapters)
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Research Progress in Pb-Free Soldering
Pages 1-33
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Fracture Behavior of IMCs at Cu/Pb-Free Solder Interface
Pages 35-66
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Tensile-Compress Fatigue Behavior of Solder Joints
Pages 67-89
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Shear Creep-Fatigue Behavior of Cu/Pb-Free Solder Joints
Pages 91-118
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Thermal Fatigue Behavior of Sn–Ag/Cu Solder Joints
Pages 119-140
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Table of contents (6 chapters)
- Download Sample pages 2 PDF (1.4 MB)
- Download Table of contents PDF (108.5 KB)
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Bibliographic Information
- Bibliographic Information
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- Book Title
- Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
- Authors
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- Qingke Zhang
- Series Title
- Springer Theses
- Copyright
- 2016
- Publisher
- Springer-Verlag Berlin Heidelberg
- Copyright Holder
- Springer-Verlag Berlin Heidelberg
- eBook ISBN
- 978-3-662-48823-2
- DOI
- 10.1007/978-3-662-48823-2
- Hardcover ISBN
- 978-3-662-48821-8
- Softcover ISBN
- 978-3-662-51725-3
- Series ISSN
- 2190-5053
- Edition Number
- 1
- Number of Pages
- XV, 143
- Number of Illustrations
- 34 b/w illustrations, 81 illustrations in colour
- Topics
