Authors:
- the Chinese Academy of Sciences as an outstanding thesis in the field
- damage behavior of a series of Pb-free solder joints under different loading
- In-situ characterization techniques are used to reveal the dynamic damage process in solder joints
- The fracture behavior and fracture strength of the Cu-Sn intermetallic compound are tested
- Includes supplementary material: sn.pub/extras
Part of the book series: Springer Theses (Springer Theses)
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Table of contents (6 chapters)
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Front Matter
About this book
This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.
Authors and Affiliations
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Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou, China
Qingke Zhang
Bibliographic Information
Book Title: Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
Authors: Qingke Zhang
Series Title: Springer Theses
DOI: https://doi.org/10.1007/978-3-662-48823-2
Publisher: Springer Berlin, Heidelberg
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer-Verlag Berlin Heidelberg 2016
Hardcover ISBN: 978-3-662-48821-8Published: 16 November 2015
Softcover ISBN: 978-3-662-51725-3Published: 23 August 2016
eBook ISBN: 978-3-662-48823-2Published: 31 October 2015
Series ISSN: 2190-5053
Series E-ISSN: 2190-5061
Edition Number: 1
Number of Pages: XV, 143
Number of Illustrations: 34 b/w illustrations, 81 illustrations in colour
Topics: Solid Mechanics, Surfaces and Interfaces, Thin Films, Classical Mechanics, Characterization and Evaluation of Materials