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Springer Series in Materials Science

Chemical-Mechanical Planarization of Semiconductor Materials

Editors: Oliver, M.R. (Ed.)

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eBook $219.00
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  • ISBN 978-3-662-06234-0
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About this book

This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Table of contents (10 chapters)

Table of contents (10 chapters)

Buy this book

eBook $219.00
price for USA in USD (gross)
  • ISBN 978-3-662-06234-0
  • Digitally watermarked, DRM-free
  • Included format: PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $279.99
price for USA in USD
  • ISBN 978-3-540-43181-7
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $279.99
price for USA in USD
  • ISBN 978-3-642-07738-8
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
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Bibliographic Information

Bibliographic Information
Book Title
Chemical-Mechanical Planarization of Semiconductor Materials
Editors
  • M.R. Oliver
Series Title
Springer Series in Materials Science
Series Volume
69
Copyright
2004
Publisher
Springer-Verlag Berlin Heidelberg
Copyright Holder
Springer-Verlag Berlin Heidelberg
eBook ISBN
978-3-662-06234-0
DOI
10.1007/978-3-662-06234-0
Hardcover ISBN
978-3-540-43181-7
Softcover ISBN
978-3-642-07738-8
Series ISSN
0933-033X
Edition Number
1
Number of Pages
XI, 428
Topics