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Wafer Bonding

Applications and Technology

  • Book
  • © 2004

Overview

Editors:
  1. Marin Alexe

    1. Max-Planck Institute of Microstructure Physics, Halle (Saale), Germany

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  2. Ulrich Gösele

    1. Max-Planck Institute of Microstructure Physics, Halle (Saale), Germany

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    You can also search for this editor in PubMed   Google Scholar

  • Presents the current state of the art in wafer bonding - a technology important to microelectronic device manufacturing
  • Includes supplementary material: sn.pub/extras

Part of the book series: Springer Series in Materials Science (SSMATERIALS, volume 75)

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Table of contents (14 chapters)

  1. Front Matter

    Pages I-XV
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  2. Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding

    • J. Haisma
    Pages 1-60

  3. Basics of Silicon-on-Insulator (SOI) Technology

    • J.-P. Colinge
    Pages 61-83

  4. Silicon-on-insulator by the Smart Cut™ Process

    • G. K. Celler, A. J. Auberton-Hervé, B. Aspar, C. Lagahe-Blanchard, C. Maleville
    Pages 85-105

  5. ELTRAN® Technology Based on Wafer Bonding and Porous Silicon

    • K. Sakaguchi, T. Yonehara
    Pages 107-156

  6. Wafer Bonding for High-Performance Logic Applications

    • K. W. Guarini, H.-S. P. Wong
    Pages 157-191

  7. Application of Bonded Wafers to the Fabrication of Electronic Devices

    • A. W. Nevin
    Pages 193-261

  8. Compound Semiconductor Heterostructures by Smart Cut™: SiC On Insulator, QUASIC™ Substrates, InP and GaAs Heterostructures on Silicon

    • L. Di Cioccio, E. Jalaguier, F. Letertre
    Pages 263-314

  9. Three-Dimensional Photonic Bandgap Crystals by Wafer Bonding Approach

    • S. Noda
    Pages 315-326

  10. Wafer Direct Bonding for High-Brightness Light-Emitting Diodes and Vertical-Cavity Surface-Emitting Lasers

    • A. Plößl
    Pages 327-357

  11. High-Density Hybrid Integration of III–V Compound Optoelectronics with Silicon Integrated Circuits

    • E. D. Kyriakis-Bitzaros, G. Halkias
    Pages 359-376

  12. Layer Transfer by Bonding and Laser Lift-Off

    • T. D. Sands, W. S. Wong, N. W. Cheung
    Pages 377-415

  13. Single-Crystal Lithium Niobate Films by Crystal Ion Slicing

    • M. Levy, A. M. Radojevic
    Pages 417-450

  14. Wafer Bonding of Ferroelectric Materials

    • M. Alexe, I. Radu, I. Szafraniak
    Pages 451-471

  15. Debonding of Wafer-Bonded Interfaces for Handling and Transfer Applications

    • J. Bagdahn, M. Petzold
    Pages 473-494

  16. Back Matter

    Pages 495-503
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Keywords

About this book

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Reviews

From the reviews:

"Wafer bonding, also known as direct wafer bonding or wafer fusion, has developed from an almost obscure niche technology in the 1980s … . Anyone interested in learning about the basics of wafer bonding and its various application areas, will likely be served by this outstanding volume while the researcher engaged in studies on applied and technological aspects of wafer bonding, will find up-to-date information about this fast-moving area, including relevant patent information." (Current Engineering Practice, Vol. 47 (3), 2004 - 2005)

Editors and Affiliations

  • Max-Planck Institute of Microstructure Physics, Halle (Saale), Germany

    Marin Alexe, Ulrich Gösele

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