Springer Series in Materials Science

Wafer Bonding

Applications and Technology

Editors: Alexe, Marin, Gösele, Ulrich (Eds.)

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About this book

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Reviews

From the reviews:

"Wafer bonding, also known as direct wafer bonding or wafer fusion, has developed from an almost obscure niche technology in the 1980s … . Anyone interested in learning about the basics of wafer bonding and its various application areas, will likely be served by this outstanding volume while the researcher engaged in studies on applied and technological aspects of wafer bonding, will find up-to-date information about this fast-moving area, including relevant patent information." (Current Engineering Practice, Vol. 47 (3), 2004 - 2005)


Table of contents (14 chapters)

Table of contents (14 chapters)
  • Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding

    Pages 1-60

    Haisma, J.

  • Basics of Silicon-on-Insulator (SOI) Technology

    Pages 61-83

    Colinge, J.-P.

  • Silicon-on-insulator by the Smart Cut™ Process

    Pages 85-105

    Celler, G. K. (et al.)

  • ELTRAN® Technology Based on Wafer Bonding and Porous Silicon

    Pages 107-156

    Sakaguchi, K. (et al.)

  • Wafer Bonding for High-Performance Logic Applications

    Pages 157-191

    Guarini, K. W. (et al.)

Buy this book

eBook $219.00
price for USA in USD
  • ISBN 978-3-662-10827-7
  • Digitally watermarked, DRM-free
  • Included format:
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $379.99
price for USA in USD
  • ISBN 978-3-540-21049-8
  • Free shipping for individuals worldwide
  • Institutional customers should get in touch with their account manager
  • Covid-19 shipping restrictions
  • Usually ready to be dispatched within 3 to 5 business days, if in stock
Softcover $279.99
price for USA in USD
  • ISBN 978-3-642-05915-5
  • Free shipping for individuals worldwide
  • Institutional customers should get in touch with their account manager
  • Covid-19 shipping restrictions
  • Usually ready to be dispatched within 3 to 5 business days, if in stock
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Bibliographic Information

Bibliographic Information
Book Title
Wafer Bonding
Book Subtitle
Applications and Technology
Editors
  • Marin Alexe
  • Ulrich Gösele
Series Title
Springer Series in Materials Science
Series Volume
75
Copyright
2004
Publisher
Springer-Verlag Berlin Heidelberg
Copyright Holder
Springer-Verlag Berlin Heidelberg
eBook ISBN
978-3-662-10827-7
DOI
10.1007/978-3-662-10827-7
Hardcover ISBN
978-3-540-21049-8
Softcover ISBN
978-3-642-05915-5
Series ISSN
0933-033X
Edition Number
1
Number of Pages
XV, 504
Number of Illustrations
363 b/w illustrations, 20 illustrations in colour
Topics