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Springer Series in Materials Science

Predictive Simulation of Semiconductor Processing

Status and Challenges

Editors: Dabowski, Jaroslaw, Weber, Eicke R. (Eds.)

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  • ISBN 978-3-662-09432-7
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Hardcover $349.99
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  • ISBN 978-3-540-20481-7
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Softcover $349.99
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  • ISBN 978-3-642-05804-2
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About this book

Predictive simulation of semiconductor processing enables researchers and developers to extend the scaling range of semiconductor devices beyond the parameter range of empirical research. It requires a thorough understanding of the basic mechanisms employed in device fabrication, such as diffusion, ion implantation, epitaxy, defect formation and annealing, and contamination. This book presents an in-depth discussion of our current understanding of key processes and identifies areas that require further work in order to achieve the goal of a comprehensive, predictive process simulation tool.

About the authors

J. Dabrowski: Born in Warsaw, Poland, Sept. 29, 1958. PhD, Institute of Physics of the Polish Academy of Science (IF PAN), Warsaw, 1989. Scientific staff member IF PAN 1983-1992; postdoctoral fellow Fritz Haber Inbstitute of the Max Planck Society, Berlin, Germany, 1990-1991; postdoctoral fellow Xerox Palo Alto Research Center, California, 1992; since 1993 with IHP-microelectronics, Frankfurt (Oder), Germany. Conference series chairman, Challenges in Predictive Process Simulation (1997, 2000, 2002); international advisory commmittee member, International Training Institute for Materials Science, Hanoi, Vietnam. Project leader, German Research Society (1998-2000); von Neuman Institute for Computing (since 1993). Author (monograph), "Silicon surfaces and formation of interfaces; basic science in the industrial world" (World Scientific, 2000). Editor (book) , ""Recent Developments in Vacuum Science and Technology" (Research Signpost, 2003). Research in atomic diffusion mechanism in solid state; atomic structure of surfaces and semiconductor/dielectric interfaces; atomic structure of defects in semiconductors and insulators; signal processing for telecommunication. Achievements include discovery of atomic structure of the clean Si(113) surface; atomic structure of the main electron trap in GaAs (EL2 defect); atomic structure of the interface between a high-K dielectric (Pr2O3) and Si(001). Patents for silicon microelectronic technology; patents pending for telecommunication.

Reviews

From the reviews:

"This book presents an in-depth discussion of our current understanding of key processes and identifies areas that require further work in order to achieve the goal of a comprehensive, predictive process simulation tool. Eleven contributions make up the book; each is supported by a wealth of references. … A valuable reference and guide to have on the shelf for frequent use and study. Certainly, the expertise and research experience of the contributors cannot be questioned. Summing up ... a richly rewarding work." (Current Engineering Practice, Vol. 47 (3), 2004-2005)


Table of contents (11 chapters)

Table of contents (11 chapters)

Buy this book

eBook $269.00
price for USA in USD (gross)
  • ISBN 978-3-662-09432-7
  • Digitally watermarked, DRM-free
  • Included format: PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $349.99
price for USA in USD
  • ISBN 978-3-540-20481-7
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $349.99
price for USA in USD
  • ISBN 978-3-642-05804-2
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
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Bibliographic Information

Bibliographic Information
Book Title
Predictive Simulation of Semiconductor Processing
Book Subtitle
Status and Challenges
Editors
  • Jaroslaw Dabowski
  • Eicke R. Weber
Series Title
Springer Series in Materials Science
Series Volume
72
Copyright
2004
Publisher
Springer-Verlag Berlin Heidelberg
Copyright Holder
Springer-Verlag Berlin Heidelberg
eBook ISBN
978-3-662-09432-7
DOI
10.1007/978-3-662-09432-7
Hardcover ISBN
978-3-540-20481-7
Softcover ISBN
978-3-642-05804-2
Series ISSN
0933-033X
Edition Number
1
Number of Pages
XVII, 490
Number of Illustrations
161 b/w illustrations, 16 illustrations in colour
Topics