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Managing More-than-Moore Integration Technology Development

A Story of an Advanced Technology Program in the Semiconductor Industry

Authors: Radojcic, Ratibor

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    • Based on real, hands-on experiences and presents actual lessons learned;
    • Describes various aspects of managing an engineering development program;
    • Explains key technical aspects of semiconductor technology to non-experts;
    • Written in a novelized form that makes it very easy to read;
    • Enables an understanding of how and why the chip industry evolved over the last 50 years into what it is today.
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eBook $29.99
price for USA in USD (gross)
  • ISBN 978-3-319-92701-5
  • Digitally watermarked, DRM-free
  • Included format: PDF, EPUB
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $39.99
price for USA in USD
  • ISBN 978-3-319-92700-8
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $39.99
price for USA in USD
  • ISBN 978-3-030-06495-2
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
About this book

This book presents the real challenges and experiences of managing an advanced semiconductor technology development and integration program – but using a novelized form. The material is presented in a conversational format through a story that follows a fictional narrator as she grows from an intern to a manager in a (fictional) chip company. The story describes the technology development program from management, engineering and human perspectives, and exposes not only the management and technical issues but also the typical work-life balance challenges experienced by engineers working in the technology industry. Use of a series of realistic and representative vignettes, supported by a set of illustrative cartoon-ish panels, presents the serious management topics in a light and readable way.

About the authors

Riko Radojcic is an independent consultant specialized in 2.5D and 3D integration technologies, DfX process-design integration techniques, and advanced technology management.

Most recently, he was a Senior Director of Technology at Qualcomm Technologies Inc. where he led the 2.5D and 3D Technology Integration team, addressing all aspects of advanced integration options, ranging from architecture down to manufacturability.  In the previous years with Qualcomm, Riko has led a number of Design-for-Technology initiatives, including Design-for-3D, Design-for-Thermal, Design-for-Stress, Design-for-Variability, Design-for-Manufacturability, etc.

Radojcic has more than thirty years’ experience in the semiconductor industry, and has specialized in integration of process technology and design considerations.  Before joining Qualcomm, he was an independent consultant to semiconductor and EDA companies providing engineering and business development services. Before that, he focused on design technology, process characterization and modeling integration, with PDF Solutions (director of marketing), Tality Corporation (Business Manager) and Cadence (architect).  Radojcic has held a series of managerial and engineering positions with Unisys and Burroughs, in device engineering, failure analyses and reliability engineering areas. He began his career as a process engineer with Ferranti Electronics, UK.

Radojcic received his BSc and PhD degrees from University of Salford (Manchester), UK.

Table of contents (23 chapters)

Table of contents (23 chapters)

Buy this book

eBook $29.99
price for USA in USD (gross)
  • ISBN 978-3-319-92701-5
  • Digitally watermarked, DRM-free
  • Included format: PDF, EPUB
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $39.99
price for USA in USD
  • ISBN 978-3-319-92700-8
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $39.99
price for USA in USD
  • ISBN 978-3-030-06495-2
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
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Bibliographic Information

Bibliographic Information
Book Title
Managing More-than-Moore Integration Technology Development
Book Subtitle
A Story of an Advanced Technology Program in the Semiconductor Industry
Authors
Copyright
2019
Publisher
Springer International Publishing
Copyright Holder
Springer International Publishing AG, part of Springer Nature
eBook ISBN
978-3-319-92701-5
DOI
10.1007/978-3-319-92701-5
Hardcover ISBN
978-3-319-92700-8
Softcover ISBN
978-3-030-06495-2
Edition Number
1
Number of Pages
X, 211
Number of Illustrations
4 b/w illustrations, 63 illustrations in colour
Topics