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Springer Series in Advanced Microelectronics

3D Microelectronic Packaging

From Fundamentals to Applications

Editors: Li, Yan, Goyal, Deepak (Eds.)

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  • Provides comprehensive coverage of the state-of-the-art in 3D microelectronic packages
  • Covers advanced materials and processes, quality and reliability concerns, and fault isolation and failure analysis
  • Discusses 3D electronic package architecture and assembly process design
  • Features contributions from both academic and industry authors, for a complete view of this important technology
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eBook $169.00
price for USA in USD (gross)
  • ISBN 978-3-319-44586-1
  • Digitally watermarked, DRM-free
  • Included format: PDF, EPUB
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $219.99
price for USA in USD
  • ISBN 978-3-319-44584-7
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $219.99
price for USA in USD
  • ISBN 978-3-319-83086-5
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
About this book

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development. 

Table of contents (15 chapters)

Table of contents (15 chapters)

Buy this book

eBook $169.00
price for USA in USD (gross)
  • ISBN 978-3-319-44586-1
  • Digitally watermarked, DRM-free
  • Included format: PDF, EPUB
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $219.99
price for USA in USD
  • ISBN 978-3-319-44584-7
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $219.99
price for USA in USD
  • ISBN 978-3-319-83086-5
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
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Bibliographic Information

Bibliographic Information
Book Title
3D Microelectronic Packaging
Book Subtitle
From Fundamentals to Applications
Editors
  • Yan Li
  • Deepak Goyal
Series Title
Springer Series in Advanced Microelectronics
Series Volume
57
Copyright
2017
Publisher
Springer International Publishing
Copyright Holder
Springer International Publishing AG, part of Springer Nature
eBook ISBN
978-3-319-44586-1
DOI
10.1007/978-3-319-44586-1
Hardcover ISBN
978-3-319-44584-7
Softcover ISBN
978-3-319-83086-5
Series ISSN
1437-0387
Edition Number
1
Number of Pages
IX, 463
Number of Illustrations
78 b/w illustrations, 253 illustrations in colour
Topics