Authors:
- Provides a comprehensive overview of reliability modeling and optimization techniques at different hardware and software levels;
- Describes novel optimization techniques for software cross-layer reliability, targeting unreliable hardware.
- Includes supplementary material: sn.pub/extras
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Table of contents (8 chapters)
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Front Matter
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Back Matter
About this book
This book describes novel software concepts to increase reliability under user-defined constraints. The authors’ approach bridges, for the first time, the reliability gap between hardware and software. Readers will learn how to achieve increased soft error resilience on unreliable hardware, while exploiting the inherent error masking characteristics and error (stemming from soft errors, aging, and process variations) mitigations potential at different software layers.
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Authors and Affiliations
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CES – Chair for Embedded Systems, Karlsruhe Institute of Technology, Karlsruhe, Germany
Semeen Rehman
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Department of Computer Science, Karlsruhe Institute of Technology, Karlsruhe, Germany
Muhammad Shafique, Jörg Henkel
About the authors
Muhammad Shafique received his Ph.D. in Computer Science from Karlsruhe Institute of Technology (KIT) , Germany in 2011. Before, he was with Streaming Networks Pvt. Ltd. (2003-06) and WorldCall Multimedia (2001). Mr. Shafique received his B.Sc. Engineering degree (4 Gold Medals) from University of Engineering and Technology (UET) Lahore, Pakistan in 2000. He then completed his Masters in Information Technology (2 Gold Medals) from Pakistan Institute of Engineering and Applied Sciences (PIEAS) in 2003. He has also acquired an in-depth understanding of various video coding standards (HEVC , H.264/AVC , MVC, MPEG-1/2/4).
Bibliographic Information
Book Title: Reliable Software for Unreliable Hardware
Book Subtitle: A Cross Layer Perspective
Authors: Semeen Rehman, Muhammad Shafique, Jörg Henkel
DOI: https://doi.org/10.1007/978-3-319-25772-3
Publisher: Springer Cham
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer International Publishing Switzerland 2016
Hardcover ISBN: 978-3-319-25770-9Published: 29 April 2016
Softcover ISBN: 978-3-319-79838-7Published: 22 April 2018
eBook ISBN: 978-3-319-25772-3Published: 20 April 2016
Edition Number: 1
Number of Pages: XXVIII, 237
Number of Illustrations: 38 b/w illustrations, 83 illustrations in colour
Topics: Circuits and Systems, Processor Architectures, Electronics and Microelectronics, Instrumentation