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  • © 2016

Design for Manufacturability with Advanced Lithography

Authors:

  • Enables readers to tackle the challenge of layout decompositions for different patterning techniques
  • Presents a coherent framework, including standard cell compliance and detailed placement, to enable Triple Patterning Lithography (TPL) friendly design
  • Includes coverage of the design for manufacturability with E-Beam lithography

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Table of contents (6 chapters)

  1. Front Matter

    Pages i-xi
  2. Introduction

    • Bei Yu, David Z. Pan
    Pages 1-6
  3. Layout Decomposition for Triple Patterning

    • Bei Yu, David Z. Pan
    Pages 7-51
  4. Layout Decomposition for Other Patterning Techniques

    • Bei Yu, David Z. Pan
    Pages 53-82
  5. Standard Cell Compliance and Placement Co-Optimization

    • Bei Yu, David Z. Pan
    Pages 83-109
  6. Design for Manufacturability with E-Beam Lithography

    • Bei Yu, David Z. Pan
    Pages 111-157
  7. Conclusions and Future Works

    • Bei Yu, David Z. Pan
    Pages 159-162
  8. Back Matter

    Pages 163-164

About this book

This book introduces readers to the most advanced research results on Design for Manufacturability (DFM) with multiple patterning lithography (MPL) and electron beam lithography (EBL). The authors describe in detail a set of algorithms/methodologies to resolve issues in modern design for manufacturability problems with advanced lithography. Unlike books that discuss DFM from the product level or physical manufacturing level, this book describes DFM solutions from a circuit design level, such that most of the critical problems can be formulated and solved through combinatorial algorithms.

Authors and Affiliations

  • ECE Department, The University of Texas, Austin, USA

    Bei Yu, David Z. Pan

Bibliographic Information

  • Book Title: Design for Manufacturability with Advanced Lithography

  • Authors: Bei Yu, David Z. Pan

  • DOI: https://doi.org/10.1007/978-3-319-20385-0

  • Publisher: Springer Cham

  • eBook Packages: Engineering, Engineering (R0)

  • Copyright Information: Springer International Publishing Switzerland 2016

  • Hardcover ISBN: 978-3-319-20384-3Published: 23 November 2015

  • Softcover ISBN: 978-3-319-37393-5Published: 23 August 2016

  • eBook ISBN: 978-3-319-20385-0Published: 28 October 2015

  • Edition Number: 1

  • Number of Pages: XI, 164

  • Topics: Circuits and Systems, Processor Architectures, Electronics and Microelectronics, Instrumentation

Buy it now

Buying options

eBook USD 39.99
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book USD 54.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book USD 54.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Other ways to access