Authors:
- Introduces a robust model that captures accurately all the loss modes of a TSV, coupling parasitics between TSVs and the TSV nonlinear capacitance and resistance of the depletion region
- Enables readers to use a model which is technology dependent and can be used for any TSV configuration
- Reveals a novel on-chip wireless communication technique, based on TSV spiral inductors
- Equips readers for fast parasitic extraction of TSVs for 3D IC design
- Includes supplementary material: sn.pub/extras
Part of the book series: Analog Circuits and Signal Processing (ACSP)
Buy it now
Buying options
Tax calculation will be finalised at checkout
Other ways to access
This is a preview of subscription content, log in via an institution to check for access.
Table of contents (10 chapters)
-
Front Matter
-
Back Matter
About this book
Authors and Affiliations
-
Mentor Graphics, Heliopolis, Egypt
Khaled Salah, Alaa El-Rouby
-
The American University (New Cairo) and Zewail City of Science and Technology (6th of October City), New Cairo, Egypt
Yehea Ismail
Bibliographic Information
Book Title: Arbitrary Modeling of TSVs for 3D Integrated Circuits
Authors: Khaled Salah, Yehea Ismail, Alaa El-Rouby
Series Title: Analog Circuits and Signal Processing
DOI: https://doi.org/10.1007/978-3-319-07611-9
Publisher: Springer Cham
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer International Publishing Switzerland 2015
Hardcover ISBN: 978-3-319-07610-2Published: 05 September 2014
Softcover ISBN: 978-3-319-37497-0Published: 23 August 2016
eBook ISBN: 978-3-319-07611-9Published: 21 August 2014
Series ISSN: 1872-082X
Series E-ISSN: 2197-1854
Edition Number: 1
Number of Pages: IX, 179
Number of Illustrations: 60 b/w illustrations, 99 illustrations in colour
Topics: Circuits and Systems, Electronics and Microelectronics, Instrumentation, Processor Architectures