Overview
- Describes near-field chipless-RFID systems with high data capacity
- Reports on applications such as authentication, motion control and sensors
- Discusses important details related to tag and reader design, including tag programming
Part of the book series: Lecture Notes in Electrical Engineering (LNEE, volume 647)
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Table of contents (5 chapters)
Keywords
- Radiofrequency identification
- Chipless-RFID versus Chipped-RFID Technology
- Near-field Chipless-RFID Tags
- Time-domain versus frequency domain signature barcodes
- Microwave encoders
- Angular displacement and velocity sensors
- Chipless-RFID Sensors
- Proximity sensors
- Tag programming
- Motion control
- Secure paper and authentication
- Synchronous tag reading
- Paper-based chipless-RFID tags
- All-dielectric permittivity contrast encoders
- Organic tags
- High-data capacity chipless-RFID tags
About this book
Readers are expected to be familiar with RF/microwave engineering technology. Besides master’s and postgraduate students, the book is intended for researchers in the field of radiofrequency identification (RFID) technology, and may be of interest for engineers working in the areas of wireless communications, automatic identification, security, authentication, microwave and wireless sensors, as well as those dealing with internet of things (IoT) and smart systems.
Authors and Affiliations
Bibliographic Information
Book Title: Time-Domain Signature Barcodes for Chipless-RFID and Sensing Applications
Authors: Ferran Martín, Cristian Herrojo, Javier Mata-Contreras, Ferran Paredes
Series Title: Lecture Notes in Electrical Engineering
DOI: https://doi.org/10.1007/978-3-030-39726-5
Publisher: Springer Cham
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer Nature Switzerland AG 2020
Hardcover ISBN: 978-3-030-39725-8Published: 02 February 2020
Softcover ISBN: 978-3-030-39728-9Published: 02 February 2021
eBook ISBN: 978-3-030-39726-5Published: 01 February 2020
Series ISSN: 1876-1100
Series E-ISSN: 1876-1119
Edition Number: 1
Number of Pages: XVI, 142
Topics: Microwaves, RF and Optical Engineering, Electronics and Microelectronics, Instrumentation, Artificial Intelligence, Optical and Electronic Materials