Advanced Thermal Stress Analysis of Smart Materials and Structures
Authors: Chen, Zengtao, Akbarzadeh, Hamid
Free Preview- A first monograph on thermal stress analysis based on non-Fourier heat conduction theories
- Includes applications of non-Fourier heat conduction in thermal stress analysis of smart materials and structures
- Summarizies non-Fourier heat conduction theories, an emerging topic in thermal fluids
Buy this book
- About this book
-
This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures.
The book contains six chapters and starts with a brief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introduced through reviewing the methods for solving non-Fourier heat conduction theories and by presenting transient heat transport in representative homogeneous and advanced heterogeneous materials. The book provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry.
A series of uncoupled thermal stress analyses on one-dimensional structures are also included. The volume ends with coupled thermal stress analyses of one-dimensional homogenous and heterogeneous smart piezoelectric structures considering different coupled thermopiezoelectric theories. Last but not least, fracture behavior of smart structures under thermal disturbance is investigated and the authors propose directions for future research on the topic of multiphysical analysis of smart materials.
- Table of contents (7 chapters)
-
-
Heat Conduction and Moisture Diffusion Theories
Pages 1-22
-
Basic Problems of Non-Fourier Heat Conduction
Pages 23-63
-
Multiphysics of Smart Materials and Structures
Pages 65-117
-
Coupled Thermal Stresses in Advanced Smart Materials
Pages 119-170
-
Thermal Fracture of Advanced Materials Based on Fourier Heat Conduction
Pages 171-242
-
Table of contents (7 chapters)
Recommended for you
Bibliographic Information
- Bibliographic Information
-
- Book Title
- Advanced Thermal Stress Analysis of Smart Materials and Structures
- Authors
-
- Zengtao Chen
- Hamid Akbarzadeh
- Series Title
- Structural Integrity
- Series Volume
- 10
- Copyright
- 2020
- Publisher
- Springer International Publishing
- Copyright Holder
- Springer Nature Switzerland AG
- eBook ISBN
- 978-3-030-25201-4
- DOI
- 10.1007/978-3-030-25201-4
- Hardcover ISBN
- 978-3-030-25200-7
- Series ISSN
- 2522-560X
- Edition Number
- 1
- Number of Pages
- X, 304
- Number of Illustrations
- 60 b/w illustrations, 44 illustrations in colour
- Topics
*immediately available upon purchase as print book shipments may be delayed due to the COVID-19 crisis. ebook access is temporary and does not include ownership of the ebook. Only valid for books with an ebook version. Springer Reference Works and instructor copies are not included.
