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Silicon Analog Components

Device Design, Process Integration, Characterization, and Reliability

Authors: El-Kareh, Badih, Hutter, Lou N.

  • Enables engineers to understand analog device physics, and discusses important relations between process integration, device design, component characteristics, and reliability
  • Describes in step-by-step fashion the components that are used in analog designs, the particular characteristics of analog components, while comparing them to digital applications
  • Explains the second-order effects in analog devices, and trade-offs between these effects when designing components and developing an integrated process for their manufacturing
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Buy this book

eBook $89.00
price for USA in USD (gross)
  • The eBook version of this title will be available soon
  • Due: September 12, 2019
  • ISBN 978-3-030-15085-3
  • Digitally watermarked, DRM-free
  • Included format:
  • ebooks can be used on all reading devices
Hardcover $119.99
price for USA in USD
  • Customers within the U.S. and Canada please contact Customer Service at +1-800-777-4643, Latin America please contact us at +1-212-460-1500 (24 hours a day, 7 days a week).
  • Due: August 15, 2019
  • ISBN 978-3-030-15084-6
  • Free shipping for individuals worldwide
About this Textbook

This book covers modern analog components, their characteristics, and interactions with process parameters. It serves as a comprehensive guide, addressing both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. Based on the authors’ extensive experience in the development of analog devices, this book is intended for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science.

  • Enables engineers to understand analog device physics, and discusses important relations between process integration, device design, component characteristics, and reliability;
  • Describes in step-by-step fashion the components that are used in analog designs, the particular characteristics of analog components, while comparing them to digital applications;
  • Explains the second-order effects in analog devices, and trade-offs between these effects when designing components and developing an integrated process for their manufacturing.


About the authors

Dr. Badih El-Kareh is an independent consultant, retired IBM and Texas Instruments physicist. He has over 40 years’ experience in semiconductor device design, process integration, and characterization. This includes the development of advanced CMOS and BiCMOS processes and devices for analog, memory, digital, and high-voltage applications. He has 30 years’ experience in academic and industrial teaching and is author of a book on VLSI Silicon Devices, a book on Modern Semiconductor Processing Technologies, and a book on Silicon Devices and Process Integration. He authored and co-authored 35 papers and has 52 US patents issued. Dr. El-Kareh is a senior member of the IEEE.

Lou Hutter has almost 35 years of experience in the semiconductor industry. As Director of the Mixed-Signal Technology Development group at TI, he was responsible for all analog, mixed-signal, RF, and power technology development in the company, supporting every major business unit. After retiring from TI in 2007, he became the General Manager of the Analog Foundry business unit at Dongbu HiTek, a S. Korean foundry, where he was a Senior VP. He was elected a TI Fellow in 1995, holds 47 U.S. patents, and has co-authored over 30 papers. His focus areas have been in high-performance analog CMOS, high-power BCD technology, power metallization, SiGe BiCMOS, technology road-mapping, and technology development methodology.


Buy this book

eBook $89.00
price for USA in USD (gross)
  • The eBook version of this title will be available soon
  • Due: September 12, 2019
  • ISBN 978-3-030-15085-3
  • Digitally watermarked, DRM-free
  • Included format:
  • ebooks can be used on all reading devices
Hardcover $119.99
price for USA in USD
  • Customers within the U.S. and Canada please contact Customer Service at +1-800-777-4643, Latin America please contact us at +1-212-460-1500 (24 hours a day, 7 days a week).
  • Due: August 15, 2019
  • ISBN 978-3-030-15084-6
  • Free shipping for individuals worldwide
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Bibliographic Information

Bibliographic Information
Book Title
Silicon Analog Components
Book Subtitle
Device Design, Process Integration, Characterization, and Reliability
Authors
Copyright
2020
Publisher
Springer International Publishing
Copyright Holder
Springer Nature Switzerland AG
eBook ISBN
978-3-030-15085-3
DOI
10.1007/978-3-030-15085-3
Hardcover ISBN
978-3-030-15084-6
Edition Number
2
Number of Pages
XLIX, 666
Number of Illustrations
310 b/w illustrations, 156 illustrations in colour
Topics