Overview
- Introduces readers to challenges and best practices in designing TSVs for 3D integrated circuits
- Discusses how TSVs induce noise affecting neighboring devices, provides a methodology to evaluate noise and evaluates several techniques to eliminate and reduce TSV noise
- Investigates the impact of TSV size and granularity on power delivery for 3D ICs within a novel framework that considers architectural setups and benchmarks
- Explores the use of Carbon Nanotubes for power grid design
Part of the book series: SpringerBriefs in Electrical and Computer Engineering (BRIEFSELECTRIC)
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Table of contents (7 chapters)
Keywords
About this book
Authors and Affiliations
Bibliographic Information
Book Title: Designing TSVs for 3D Integrated Circuits
Authors: Nauman Khan, Soha Hassoun
Series Title: SpringerBriefs in Electrical and Computer Engineering
DOI: https://doi.org/10.1007/978-1-4614-5508-0
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: The Authors 2013
Softcover ISBN: 978-1-4614-5507-3Published: 23 September 2012
eBook ISBN: 978-1-4614-5508-0Published: 22 September 2012
Series ISSN: 2191-8112
Series E-ISSN: 2191-8120
Edition Number: 1
Number of Pages: X, 76
Number of Illustrations: 5 b/w illustrations, 29 illustrations in colour
Topics: Circuits and Systems, Processor Architectures, Electronics and Microelectronics, Instrumentation