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SpringerBriefs in Electrical and Computer Engineering

Designing TSVs for 3D Integrated Circuits

Authors: Khan, Nauman, Hassoun, Soha

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  • Introduces readers to challenges and best practices in designing TSVs for 3D integrated circuits
  • Discusses how TSVs induce noise affecting neighboring devices, provides a methodology to evaluate noise and evaluates several techniques to eliminate and reduce TSV noise
  • Investigates the impact of TSV size and granularity on power delivery for 3D ICs within a novel framework that considers architectural setups and benchmarks
  • Explores the use of Carbon Nanotubes for power grid design
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About this book

This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits.  It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks.  Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.

Table of contents (7 chapters)

Table of contents (7 chapters)

Buy this book

eBook $54.99
price for USA in USD
  • ISBN 978-1-4614-5508-0
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Softcover $69.99
price for USA in USD
  • ISBN 978-1-4614-5507-3
  • Free shipping for individuals worldwide
  • Immediate ebook access, if available*, with your print order
  • Usually ready to be dispatched within 3 to 5 business days.
Rent the eBook  
  • Rental duration: 1 or 6 month
  • low-cost access
  • online reader with highlighting and note-making option
  • can be used across all devices
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Bibliographic Information

Bibliographic Information
Book Title
Designing TSVs for 3D Integrated Circuits
Authors
Series Title
SpringerBriefs in Electrical and Computer Engineering
Copyright
2013
Publisher
Springer-Verlag New York
Copyright Holder
The Authors
eBook ISBN
978-1-4614-5508-0
DOI
10.1007/978-1-4614-5508-0
Softcover ISBN
978-1-4614-5507-3
Series ISSN
2191-8112
Edition Number
1
Number of Pages
X, 76
Number of Illustrations
5 b/w illustrations, 29 illustrations in colour
Topics

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