Metal-Dielectric Interfaces in Gigascale Electronics
Thermal and Electrical Stability
Authors: He, Ming, Lu, Toh-Ming
Free Preview- Presents a unified approach to understanding the diverse phenomena observed at metal-dielectric interfaces
- Features fundamental considerations in the physics and chemistry of metal-dielectric interactions
- Explores mechanisms of metal atom diffusion and metal ion drift in dielectrics
- Provides keys to understanding reliability in gigascale electronics
- Focuses on a dynamic area of current research that is a foundation of future interconnect systems, memristors, and solid-state electrolyte devices
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- About this book
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Metal-dielectric interfaces are ubiquitous in modern electronics. As advanced gigascale electronic devices continue to shrink, the stability of these interfaces is becoming an increasingly important issue that has a profound impact on the operational reliability of these devices. In this book, the authors present the basic science underlying the thermal and electrical stability of metal-dielectric interfaces and its relationship to the operation of advanced interconnect systems in gigascale electronics. Interface phenomena, including chemical reactions between metals and dielectrics, metallic-atom diffusion, and ion drift, are discussed based on fundamental physical and chemical principles. Schematic diagrams are provided throughout the book to illustrate interface phenomena and the principles that govern them.
Metal-Dielectric Interfaces in Gigascale Electronics provides a unifying approach to the diverse and sometimes contradictory test results that are reported in the literature on metal-dielectric interfaces. The goal is to provide readers with a clear account of the relationship between interface science and its applications in interconnect structures. The material presented here will also be of interest to those engaged in field-effect transistor and memristor device research, as well as university researchers and industrial scientists working in the areas of electronic materials processing, semiconductor manufacturing, memory chips, and IC design.
- Table of contents (9 chapters)
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Introduction
Pages 1-9
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Metal–Dielectric Diffusion Processes: Fundamentals
Pages 11-22
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Experimental Techniques
Pages 23-44
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Al-Dielectric Interfaces
Pages 45-55
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Cu-Dielectric Interfaces
Pages 57-74
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Table of contents (9 chapters)
- Download Preface 1 PDF (1.5 MB)
- Download Sample pages 2 PDF (1.9 MB)
- Download Table of contents PDF (1.5 MB)
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Bibliographic Information
- Bibliographic Information
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- Book Title
- Metal-Dielectric Interfaces in Gigascale Electronics
- Book Subtitle
- Thermal and Electrical Stability
- Authors
-
- Ming He
- Toh-Ming Lu
- Series Title
- Springer Series in Materials Science
- Series Volume
- 157
- Copyright
- 2012
- Publisher
- Springer-Verlag New York
- Copyright Holder
- Springer Science+Business Media, LLC
- eBook ISBN
- 978-1-4614-1812-2
- DOI
- 10.1007/978-1-4614-1812-2
- Hardcover ISBN
- 978-1-4614-1811-5
- Softcover ISBN
- 978-1-4939-4308-1
- Series ISSN
- 0933-033X
- Edition Number
- 1
- Number of Pages
- XI, 149
- Topics
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