Authors:
- Explains numerous types of electronic packaging design, including power discrete packaging, power IC packaging and power wafer level CSP
- Provides the reader with a fundamental understanding of the evolution of power packaging, while also predicting future development trends in monolithic and hybrid integrations
- Presents the most advanced simulation and modeling methodologies in electronic packaging design, reliability, and assembly to insure that practicioners can fully test their power electronic packaging designs
- Includes supplementary material: sn.pub/extras
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Table of contents (12 chapters)
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Front Matter
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Back Matter
About this book
Authors and Affiliations
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Fairchild Semiconductor Corporation, South Portland, USA
Yong Liu
Bibliographic Information
Book Title: Power Electronic Packaging
Book Subtitle: Design, Assembly Process, Reliability and Modeling
Authors: Yong Liu
DOI: https://doi.org/10.1007/978-1-4614-1053-9
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer Science+Business Media, LLC 2012
Hardcover ISBN: 978-1-4614-1052-2
Softcover ISBN: 978-1-4899-8797-6
eBook ISBN: 978-1-4614-1053-9
Edition Number: 1
Number of Pages: XVIII, 594
Topics: Power Electronics, Electrical Machines and Networks, Electronics and Microelectronics, Instrumentation, Solid State Physics, Spectroscopy and Microscopy, Circuits and Systems