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3D Integration for NoC-based SoC Architectures

  • Book
  • © 2011

Overview

Editors:
  1. Abbas Sheibanyrad

    1. TIMA Laboratory, Grenoble, France

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    You can also search for this editor in PubMed   Google Scholar

  2. Frédéric Pétrot

    1. TIMA Laboratory, Grenoble, France

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    You can also search for this editor in PubMed   Google Scholar

  3. Axel Jantsch

    1. Royal Institute of Technology, Kista, Sweden

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    You can also search for this editor in PubMed   Google Scholar

  • Provides a detailed background on the state of error control methods for on-chip interconnects, including Error Control Coding, Double Sampling, and On-Line Testing
  • Describes the use of more complex concatenated codes such as Hamming Product Codes with Type-II HARQ, while emphasizing integration techniques for on-chip interconnect links
  • Presents techniques for managing intermittent and permanent errors using a non-interrupting in-line test method with spare wire replacement
  • Includes supplementary material: sn.pub/extras

Part of the book series: Integrated Circuits and Systems (ICIR)

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Table of contents (11 chapters)

  1. Front Matter

    Pages 1-1
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  2. 3DI Promises and Challenges

    1. Front Matter

      Pages 1-1
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    2. Three-Dimensional Integration of Integrated Circuits—an Introduction

      • Chuan Seng Tan
      Pages 3-26

    3. The Promises and Limitations of 3-D Integration

      • Axel Jantsch, Matthew Grange, Dinesh Pamunuwa
      Pages 27-44

  3. Technology and Circuit Design

    1. Front Matter

      Pages 45-45
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    2. Testing 3D Stacked ICs Containing Through-Silicon Vias

      • Erik Jan Marinissen
      Pages 47-74

    3. Design and Computer Aided Design of 3DIC

      • Paul D. Franzon, W. Rhett Davis, Thor Thorolfsson
      Pages 75-88

    4. Physical Analysis of NoC Topologies for 3-D Integrated Systems

      • Vasilis F. Pavlidis, Eby G. Friedman
      Pages 89-114

    5. Three-Dimensional Networks-on-Chip: Performance Evaluation

      • Brett Stanley Feero, Partha Pratim Pande
      Pages 115-145

  4. System and Architecture Design

    1. Front Matter

      Pages 147-147
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    2. Asynchronous 3D-NoCs Making Use of Serialized Vertical Links

      • Abbas Sheibanyrad, Frédéric Pétrot
      Pages 149-165

    3. Design of Application-Specific 3D Networks-on-Chip Architectures

      • Shan Yan, Bill Lin
      Pages 167-191

    4. 3D Network on Chip Topology Synthesis: Designing Custom Topologies for Chip Stacks

      • Ciprian Seiculescu, Srinivasan Murali, Luca Benini, Giovanni De Micheli
      Pages 193-223

    5. 3-D NoC on Inductive Wireless Interconnect

      • Hiroki Matsutani, Michihiro Koibuchi, Tadahiro Kuroda, Hideharu Amano
      Pages 225-248

    6. Influence of Stacked 3D Memory/Cache Architectures on GPUs

      • Ahmed Al Maashri, Guangyu Sun, Xiangyu Dong, Yuan Xie, Narayanan Vijaykrishnan
      Pages 249-271

  5. Back Matter

    Pages 266-266
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Keywords

About this book

This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.

Editors and Affiliations

  • TIMA Laboratory, Grenoble, France

    Abbas Sheibanyrad, Frédéric Pétrot

  • Royal Institute of Technology, Kista, Sweden

    Axel Jantsch

Bibliographic Information

  • Book Title: 3D Integration for NoC-based SoC Architectures

  • Editors: Abbas Sheibanyrad, Frédéric Pétrot, Axel Jantsch

  • Series Title: Integrated Circuits and Systems

  • DOI: https://doi.org/10.1007/978-1-4419-7618-5

  • Publisher: Springer New York, NY

  • eBook Packages: Engineering, Engineering (R0)

  • Copyright Information: Springer Science+Business Media, LLC 2011

  • Hardcover ISBN: 978-1-4419-7617-8Published: 10 December 2010

  • Softcover ISBN: 978-1-4614-2748-3Published: 27 December 2012

  • eBook ISBN: 978-1-4419-7618-5Published: 08 November 2010

  • Series ISSN: 1558-9412

  • Series E-ISSN: 1558-9420

  • Edition Number: 1

  • Number of Pages: X, 278

  • Topics: Circuits and Systems, Software Engineering

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