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MEMS Reference Shelf

Silicon Carbide Microsystems for Harsh Environments

Authors: Wijesundara, Muthu, Azevedo, Robert

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  • Addresses the SiC platform for complete microsystems and goes beyond the individual device level
  • Covers state-of-the-art SiC electronics
  • Provides a comprehensive collection of SiC technologies information relevant to harsh environment microsystems
  • Covers the challenges in combining SiC process and components to a microsystem
  • Discusses power source and signal transmission issues in the context of the harsh environment application space
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eBook $119.00
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  • ISBN 978-1-4419-7121-0
  • Digitally watermarked, DRM-free
  • Included format: PDF
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  • Immediate eBook download after purchase
Hardcover $199.99
price for USA in USD
  • ISBN 978-1-4419-7120-3
  • Free shipping for individuals worldwide
  • Institutional customers should get in touch with their account manager
  • Covid-19 shipping restrictions
  • Usually ready to be dispatched within 3 to 5 business days, if in stock
Softcover $159.99
price for USA in USD
  • ISBN 978-1-4614-2882-4
  • Free shipping for individuals worldwide
  • Institutional customers should get in touch with their account manager
  • Covid-19 shipping restrictions
  • Usually ready to be dispatched within 3 to 5 business days, if in stock
About this book

<p><em>Silicon Carbide Microsystems for Harsh Environments</em> reviews state-of-the-art Silicon Carbide (SiC) technologies that, when combined, create microsystems capable of surviving in harsh environments. Technological readiness of the system components, key issues when integrating these components into systems, and other hurdles in harsh environment operation are discussed at length. The authors use the SiC technology platform suite as the model platform for developing harsh environment Microsystems, and then detail the current status of the specific individual technologies (electronics, MEMS, packaging). Additionally, methods towards system level integration of components and key challenges are evaluated and discussed based on the current state of SiC materials processing and device technology. Issues such as temperature mismatch, process compatibility and temperature stability of individual components and how these issues manifest when building the system receive thorough investigation. This book also: </p>
<ul>
    <li>Addresses the SiC platform for complete microsystems and goes beyond the individual device level</li>
    <li>Provides a comprehensive collection of SiC technologies information relevant to harsh environment microsystems</li>
    <li>Covers the challenges in combining SiC process and components to a microsystem</li>
    <li>Discusses power source and signal transmission issues in the context of the harsh environment application space </li>
</ul>
<p><em>Silicon Carbide Microsystems for Harsh Environments</em> not only reviews the state-of-the-art MEMS devices, but also provides a framework for the joining of electronics and MEMS along with packaging into usable harsh-environment-ready sensor modules.</p>

Table of contents (6 chapters)

Table of contents (6 chapters)

Buy this book

eBook $119.00
price for USA in USD
  • ISBN 978-1-4419-7121-0
  • Digitally watermarked, DRM-free
  • Included format: PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $199.99
price for USA in USD
  • ISBN 978-1-4419-7120-3
  • Free shipping for individuals worldwide
  • Institutional customers should get in touch with their account manager
  • Covid-19 shipping restrictions
  • Usually ready to be dispatched within 3 to 5 business days, if in stock
Softcover $159.99
price for USA in USD
  • ISBN 978-1-4614-2882-4
  • Free shipping for individuals worldwide
  • Institutional customers should get in touch with their account manager
  • Covid-19 shipping restrictions
  • Usually ready to be dispatched within 3 to 5 business days, if in stock
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Bibliographic Information

Bibliographic Information
Book Title
Silicon Carbide Microsystems for Harsh Environments
Authors
Series Title
MEMS Reference Shelf
Series Volume
22
Copyright
2011
Publisher
Springer-Verlag New York
Copyright Holder
Springer Science+Business Media, LLC
eBook ISBN
978-1-4419-7121-0
DOI
10.1007/978-1-4419-7121-0
Hardcover ISBN
978-1-4419-7120-3
Softcover ISBN
978-1-4614-2882-4
Series ISSN
1936-4407
Edition Number
1
Number of Pages
XVI, 232
Topics