Integrated Circuits and Systems

Three-Dimensional Integrated Circuit Design

EDA, Design and Microarchitectures

Editors: Xie, Yuan, Cong, Jingsheng Jason, Sapatnekar, Sachin (Eds.)

  • Contains a thorough survey of the field for 3D EDA tools
  • Provides a clear understanding of the need of adopting 3D IC design, and an overview of existing techniques to help 3D IC design
  • Covers the motivation and intuition behind the techniques that helps 3D design, leading to the ability to better take advantage of the 3D IC design
  • Includes fundamental knowledge of 3D process, and 3D EDA tools that can help the architectural level design exploration
  • Provides an understanding of the benefits and limitations of the 3D design at the architectural level, leading to novel 3D microarchitecture design
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eBook 107,09 €
price for Spain (gross)
  • ISBN 978-1-4419-0784-4
  • Digitally watermarked, DRM-free
  • Included format: PDF, EPUB
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover 166,39 €
price for Spain (gross)
  • ISBN 978-1-4419-0783-7
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
  • The final prices may differ from the prices shown due to specifics of VAT rules
Softcover 136,06 €
price for Spain (gross)
  • ISBN 978-1-4614-2513-7
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
  • The final prices may differ from the prices shown due to specifics of VAT rules
About this book

This book presents an overview of the field of 3D IC design, with an

emphasis on electronic design automation (EDA) tools and algorithms

that can enable the adoption of 3D ICs, and the architectural

implementation and potential for future 3D system design. The aim of

this book is to provide the reader with a complete understanding of:

  • the promise of 3D ICs in building novel systems that enable the chip

industry to continue along the path of performance scaling,

  • the state of the art in fabrication technologies for 3D integration,

  • the most prominent 3D-specific EDA challenges, along with solutions

and best practices,

  • the architectural benefits of using 3D technology,

  • architectural-and system-level design issues, and

  • the cost implications of 3D IC design.

Three Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures is intended for practitioners in the field, researchers and graduate students seeking to know more about 3D IC design.

Table of contents (10 chapters)

  • Introduction

    Bernstein, Kerry

    Pages 1-13

    Preview Buy Chapter 30,19 €
  • 3D Process Technology Considerations

    Young, Albert M. (et al.)

    Pages 15-32

    Preview Buy Chapter 30,19 €
  • Thermal and Power Delivery Challenges in 3D ICs

    Jain, Pulkit (et al.)

    Pages 33-61

    Preview Buy Chapter 30,19 €
  • Thermal-Aware 3D Floorplan

    Cong, Jason (et al.)

    Pages 63-102

    Preview Buy Chapter 30,19 €
  • Thermal-Aware 3D Placement

    Cong, Jason (et al.)

    Pages 103-144

    Preview Buy Chapter 30,19 €

Buy this book

eBook 107,09 €
price for Spain (gross)
  • ISBN 978-1-4419-0784-4
  • Digitally watermarked, DRM-free
  • Included format: PDF, EPUB
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover 166,39 €
price for Spain (gross)
  • ISBN 978-1-4419-0783-7
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
  • The final prices may differ from the prices shown due to specifics of VAT rules
Softcover 136,06 €
price for Spain (gross)
  • ISBN 978-1-4614-2513-7
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
  • The final prices may differ from the prices shown due to specifics of VAT rules
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Bibliographic Information

Bibliographic Information
Book Title
Three-Dimensional Integrated Circuit Design
Book Subtitle
EDA, Design and Microarchitectures
Editors
  • Yuan Xie
  • Jingsheng Jason Cong
  • Sachin Sapatnekar
Series Title
Integrated Circuits and Systems
Copyright
2010
Publisher
Springer US
Copyright Holder
Springer-Verlag US
eBook ISBN
978-1-4419-0784-4
DOI
10.1007/978-1-4419-0784-4
Hardcover ISBN
978-1-4419-0783-7
Softcover ISBN
978-1-4614-2513-7
Series ISSN
1558-9412
Edition Number
1
Number of Pages
XII, 284
Topics