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The Springer International Series in Engineering and Computer Science

Simulated Annealing for VLSI Design

Authors: Wong, D.F., Leong, H.W., Liu, H.W.

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About this book

This monograph represents a summary of our work in the last two years in applying the method of simulated annealing to the solution of problems that arise in the physical design of VLSI circuits. Our study is experimental in nature, in that we are con­ cerned with issues such as solution representations, neighborhood structures, cost functions, approximation schemes, and so on, in order to obtain good design results in a reasonable amount of com­ putation time. We hope that our experiences with the techniques we employed, some of which indeed bear certain similarities for different problems, could be useful as hints and guides for other researchers in applying the method to the solution of other prob­ lems. Work reported in this monograph was partially supported by the National Science Foundation under grant MIP 87-03273, by the Semiconductor Research Corporation under contract 87-DP- 109, by a grant from the General Electric Company, and by a grant from the Sandia Laboratories.

Reviews

`Individuals interested in design automation and, in particular, VLSI design will find this monograph a useful source of information on the application of the simulated annealing method.'
Zentralblatt für Mathematik, 699 (1991)

Table of contents (8 chapters)

Table of contents (8 chapters)

Buy this book

eBook $79.99
price for USA in USD
  • ISBN 978-1-4613-1677-0
  • Digitally watermarked, DRM-free
  • Included format: PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $169.00
price for USA in USD
Softcover $99.99
price for USA in USD
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Bibliographic Information

Bibliographic Information
Book Title
Simulated Annealing for VLSI Design
Authors
Series Title
The Springer International Series in Engineering and Computer Science
Series Volume
42
Copyright
1988
Publisher
Springer US
Copyright Holder
Kluwer Academic Publishers
eBook ISBN
978-1-4613-1677-0
DOI
10.1007/978-1-4613-1677-0
Hardcover ISBN
978-0-89838-256-3
Softcover ISBN
978-1-4612-8947-0
Series ISSN
0893-3405
Edition Number
1
Number of Pages
XII, 202
Topics