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Emerging Technology in Advanced Packaging

Foldable Flex and Thinned Silicon Multichip Packaging Technology

Editors: Balde, John W. (Ed.)

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eBook $139.00
price for USA in USD (gross)
  • ISBN 978-1-4615-0231-9
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Hardcover $249.99
price for USA in USD
  • ISBN 978-0-7923-7676-7
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Softcover $179.99
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  • ISBN 978-1-4613-4977-8
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About this book

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

Reviews

"If you are responsible for deciding on the next generation of packaging that will be used for your company's application or are steering university research and want to find high impact focus, this book is a must read....By placing all this information between two covers and having the various perspectives of the many authors clash and add to each other (and providing access to the authors), the reader is placed in a knowledgeable position from which to make their own technology investment decisions in this 3D world."
(David W Palmer, Manager Microsystems Applications, Sandia National Laboratories)

Table of contents (14 chapters)

Table of contents (14 chapters)

Buy this book

eBook $139.00
price for USA in USD (gross)
  • ISBN 978-1-4615-0231-9
  • Digitally watermarked, DRM-free
  • Included format: PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $249.99
price for USA in USD
  • ISBN 978-0-7923-7676-7
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $179.99
price for USA in USD
  • ISBN 978-1-4613-4977-8
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
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Bibliographic Information

Bibliographic Information
Book Title
Foldable Flex and Thinned Silicon Multichip Packaging Technology
Editors
  • John W. Balde
Series Title
Emerging Technology in Advanced Packaging
Series Volume
1
Copyright
2003
Publisher
Springer US
Copyright Holder
Springer Science+Business Media New York
eBook ISBN
978-1-4615-0231-9
DOI
10.1007/978-1-4615-0231-9
Hardcover ISBN
978-0-7923-7676-7
Softcover ISBN
978-1-4613-4977-8
Series ISSN
1572-087X
Edition Number
1
Number of Pages
XIX, 347
Number of Illustrations
266 b/w illustrations
Topics