Future Trends in Microelectronics

1. Front Matter

   Pages i-xiv

   PDF

2. Usli Microelectronics: Challenges and Future Directions

   1. All that Glitters isn’t Silicon

      • Herbert Kroemer

      Pages 1-12

   2. Si-Microelectronics: Perspectives, Risks, Opportunities, Challenges

      • Armin W. Wieder

      Pages 13-21

   3. Mass Production of Nanometre Devices

      • Alec N. Broers

      Pages 23-34

   4. Active Packaging: a New Fabrication Principle for High Performance Devices and Systems

      • Serge Luryi

      Pages 35-43

   5. The Wiring Challenge: Complexity and Crowding

      • T. P. Smith III, T. R. Dinger, D. C. Edelstein, J. R. Paraszczak, T. H. Ning

      Pages 45-56

   6. Physics, Materials Science, and Trends in Microelectronics

      • H. Van Houten

      Pages 57-70

   7. Growing Up in the Shadow of a Silicon ‘Older Brother’: Tales of an Abusive Childhood from GaAs and other New Technology Siblings!

      • Paul R. Jay

      Pages 71-86

   8. Comments on the National Technology Roadmap for Semiconductors

      • James F. Freedman

      Pages 87-91

3. System and Architecture Evolutions and Device Limitations

   1. Critique of Reversible Computation and other Energy Saving Techniques in Future Computational Systems

      • Paul M. Solomon

      Pages 93-109

   2. Architectural Frontiers Enabled by High Connectivity Packaging

      • Steve Nelson

      Pages 111-123

   3. Processor Performance Scaling

      • G. A. Sai-Halasz

      Pages 125-138

4. Nano and Quantum Electronics

   1. Quantum Devices for Future CSICs

      • Herb Goronkin

      Pages 139-149

   2. Challenges and Trends for the Application of Quantum-Based Devices

      • Gerald J. Iafrate, Michael A. Stroscio

      Pages 151-157

   3. Wire and Dot Related Devices

      • E. Gornik, V. Rosskopf, P. Auer, J. Smoliner, C. Wirner, W. Boxleitner et al.

      Pages 159-169

   4. Nonlithographic Fabrication and Physics of Nanowire and Nanodot Array Devices — Present and Future

      • A. A. Tager, D. Routkevitch, J. Haruyama, D. Almawlawi, L. Ryan, M. Moskovits et al.

      Pages 171-183

   5. Taming Tunnelling En Route to Mastering Mesoscopics

      • M. J. Kelly, V. A. Wilkinson

      Pages 185-195

   6. Prospects for Quantum Dot Structures Applications in Electronics and Optoelectronics

      • R. A. Suris

      Pages 197-208

   7. Architectures for Nano-Scaled Devices

      • Lex A. Akers

      Pages 209-214

5. Simulations and Modeling

   1. Simulating Electronic Transport in Semiconductor Nanostructures

      • K. Hess, P. Von Allmen, M. Grupen, L. F. Register

      Pages 215-225

Silicon technology has developed along virtually one single line: reducing the minimal size of lithographic features. But has this taken us to the point of diminishing returns? Are we now at a turning point in the logical evolution of microelectronics? Some believe that the semiconductor microelectronics industry has matured: the research game is over (comparisons with the steel industry are being made). Others believe that qualitative progress in hardware technology will come roaring back, based on innovative research.
This debate, spirited as it is, is reflected in the pages of Future Trends in Microelectronics, where such questions are discussed. What kind of research does the silicon industry need to continue its expansion? What is the technical limit to shrinking Si devices? Is there any economic sense in pursuing this limit? What are the most attractive applications of optoelectronic hybrid systems? Are there any green pastures beyond the traditional semiconductor technologies? Identifying the scenario for the future evolution of microelectronics will present a tremendous opportunity for constructive action today.

• Hardware
• electronics
• material
• modeling
• semiconductor
• simulation

• Department of Electrical Engineering, State University of New York, Stony Brook, USA

  Serge Luryi

• Department of Electrical & Computer Engineering, University of Toronto, Toronto, Canada

  Jimmy Xu

• Division of Engineering, Brown University, Providence, USA

  Alex Zaslavsky

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