cover

Mechanics of Solder Alloy Interconnects

Authors: Frear, D.R., Burchett, S.N., Morgan, H.S., Lau, J.H.

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Hardcover $295.00
price for USA in USD
  • ISBN 978-0-442-01505-3
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
About this book

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

Buy this book

Hardcover $295.00
price for USA in USD
  • ISBN 978-0-442-01505-3
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.

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Bibliographic Information

Bibliographic Information
Book Title
Mechanics of Solder Alloy Interconnects
Authors
Copyright
1994
Publisher
Springer US
Copyright Holder
Springer-Verlag US
Hardcover ISBN
978-0-442-01505-3
Edition Number
1
Number of Pages
XIV, 418
Topics