Microelectronics Packaging Handbook

1. Front Matter

   Pages i-xxvii

   PDF

2. Microelectronics Packaging Handbook: Technology Drivers

   1. Front Matter

      Pages 1-1

      PDF

   2. Microelectronics Packaging—An Overview

      • Eugene J. Rymaszewski, Rao R. Tummala, Toshihiko Watari

      Pages 3-128

   3. Package Wiring and Terminals

      • Kenneth Rose, Tsuneyo Chiba, William R. Heller, Wadie F. Mikhail

      Pages 129-198

   4. Package Electrical Design

      • Evan E. Davidson, George A. Katopis, Toshio Sudo

      Pages 199-313

   5. Heat Transfer in Electronic Packages

      • Robert E. Simons, Vincent W. Antonetti, Wataru Nakayama, Sevgin Oktay

      Pages 314-403

   6. Package Reliability

      • Lewis S. Goldmann, Robert T. Howard, Dexter A. Jeannotte

      Pages 404-555

   7. Package Manufacture

      • J. Richard Kraycir, Donald S. Cleverley, Richard F. Levine, Jerry A. Lorenzen

      Pages 556-619

3. Back Matter

   Pages 621-720

   PDF

Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool­ ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

• Phase
• Standard
• development
• electronics
• integrated circuit
• interconnect
• manufacturing
• metal
• modeling
• packaging
• production
• reliability
• simulation
• tables
• testing

`A most comprehensive book set, both well presented and well illustrated.'
IEEE Electrical Insulation Magazine, September/October 1997

• Georgia Institute of Technology, USA

  Rao R. Tummala

• Rensselaer Polytechnic Institute, USA

  Eugene J. Rymaszewski

• AGK Enterprises, USA

  Alan G. Klopfenstein

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