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Microelectronics Packaging Handbook

Technology Drivers Part I

Authors: Tummala, Rao, Rymaszewski, Eugene J., Klopfenstein, Alan G.

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eBook $269.00
price for USA in USD (gross)
  • ISBN 978-1-4615-4086-1
  • Digitally watermarked, DRM-free
  • Included format: PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $349.99
price for USA in USD
  • ISBN 978-0-412-08431-7
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $349.99
price for USA in USD
  • ISBN 978-1-4613-6829-8
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
About this book

Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool­ ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Reviews

`A most comprehensive book set, both well presented and well illustrated.'
IEEE Electrical Insulation Magazine, September/October 1997

Table of contents (6 chapters)

  • Microelectronics Packaging—An Overview

    Rymaszewski, Eugene J. (et al.)

    Pages 3-128

  • Package Wiring and Terminals

    Rose, Kenneth (et al.)

    Pages 129-198

  • Package Electrical Design

    Davidson, Evan E. (et al.)

    Pages 199-313

  • Heat Transfer in Electronic Packages

    Simons, Robert E. (et al.)

    Pages 314-403

  • Package Reliability

    Goldmann, Lewis S. (et al.)

    Pages 404-555

Buy this book

eBook $269.00
price for USA in USD (gross)
  • ISBN 978-1-4615-4086-1
  • Digitally watermarked, DRM-free
  • Included format: PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $349.99
price for USA in USD
  • ISBN 978-0-412-08431-7
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $349.99
price for USA in USD
  • ISBN 978-1-4613-6829-8
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
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Bibliographic Information

Bibliographic Information
Book Title
Microelectronics Packaging Handbook
Book Subtitle
Technology Drivers Part I
Authors
Copyright
1997
Publisher
Springer US
Copyright Holder
Springer Science+Business Media Dordrecht
eBook ISBN
978-1-4615-4086-1
DOI
10.1007/978-1-4615-4086-1
Hardcover ISBN
978-0-412-08431-7
Softcover ISBN
978-1-4613-6829-8
Edition Number
2
Number of Pages
XXVII, 720
Topics