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Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

Editors: Shacham-Diamand, Y., Osaka, T., Datta, M., Ohba, T. (Eds.)

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  • The multidisciplinarity of this book makes it an especially valuable tool for those interested in ULSI Interconnects

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  • ISBN 978-0-387-95868-2
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Hardcover $249.99
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  • ISBN 978-0-387-95867-5
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Softcover $249.99
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  • ISBN 978-1-4614-9744-8
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About this book

Advanced Nanoscale ULSI Interconnects: Fundamental and Applications brings a comprehensive description of copper based interconnect technology for Ultra Large Scale Integration (ULSI) technology to Integrated Circuit (ICs) application. This book reviews the basic technologies used today for the copper metallization of ULSI applications: deposition and planarization. It describes the materials used, their properties, and the way they are all integrated, specifically in regard to the copper integration processes and electrochemical processes in the nanoscale regime. The book also presents various novel nanoscale technologies that will link modern nanoscale electronics to future nanoscale based systems. This diverse, multidisciplinary volume will appeal to process engineers in the microelectronics industry; universities with programs in ULSI design, microelectronics, MEMS and nanoelectronics; and professionals in the electrochemical industry working with materials, plating and tool vendors.

Table of contents (35 chapters)

Table of contents (35 chapters)

Buy this book

eBook $189.00
price for USA in USD (gross)
  • ISBN 978-0-387-95868-2
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $249.99
price for USA in USD
  • ISBN 978-0-387-95867-5
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $249.99
price for USA in USD
  • ISBN 978-1-4614-9744-8
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
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Bibliographic Information

Bibliographic Information
Book Title
Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications
Editors
  • Yosi Shacham-Diamand
  • Tetsuya Osaka
  • Madhav Datta
  • Takayuki Ohba
Copyright
2009
Publisher
Springer-Verlag New York
Copyright Holder
Springer-Verlag New York
eBook ISBN
978-0-387-95868-2
DOI
10.1007/978-0-387-95868-2
Hardcover ISBN
978-0-387-95867-5
Softcover ISBN
978-1-4614-9744-8
Edition Number
1
Number of Pages
XX, 552
Topics