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High Speed Serdes Devices and Applications

  • Book
  • © 2009

Overview

  • Provides information on the features and functions typically found on HSS devices
  • Explains how HSS devices are used in protocol applications
  • Describes the features, functions, and considerations associated with designing and analyzing a reference clock distribution network
  • Includes information on how to test HSS hardware and analyze signal integrity
  • Discusses special topics related to design kits for HSS cores

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Table of contents (10 chapters)

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About this book

The simplest method of transferring data through the inputs or outputs of a silicon chip is to directly connect each bit of the datapath from one chip to the next chip. Once upon a time this was an acceptable approach. However, one aspect (and perhaps the only aspect) of chip design which has not changed during the career of the authors is Moore’s Law, which has dictated substantial increases in the number of circuits that can be manufactured on a chip. The pin densities of chip packaging technologies have not increased at the same pace as has silicon density, and this has led to a prevalence of High Speed Serdes (HSS) devices as an inherent part of almost any chip design. HSS devices are the dominant form of input/output for many (if not most) high-integration chips, moving serial data between chips at speeds up to 10 Gbps and beyond. Chip designers with a background in digital logic design tend to view HSS devices as simply complex digital input/output cells. This view ignores the complexity associated with serially moving billions of bits of data per second. At these data rates, the assumptions associated with digital signals break down and analog factors demand consideration. The chip designer who oversimplifies the problem does so at his or her own peril.

Bibliographic Information

  • Book Title: High Speed Serdes Devices and Applications

  • Authors: James Donald Rockrohr, Amanullah Mohammad, Clarence Rosser Ogilvie, Kent Dramstad, Michael A. Sorna, Jeanne Trinko Mechler, David Robert Stauffer

  • DOI: https://doi.org/10.1007/978-0-387-79834-9

  • Publisher: Springer New York, NY

  • eBook Packages: Engineering, Engineering (R0)

  • Copyright Information: Springer-Verlag US 2009

  • Hardcover ISBN: 978-0-387-79833-2Published: 23 October 2008

  • Softcover ISBN: 978-1-4419-4641-6Published: 05 November 2010

  • eBook ISBN: 978-0-387-79834-9Published: 19 December 2008

  • Edition Number: 1

  • Number of Pages: XIV, 490

  • Number of Illustrations: 20 b/w illustrations

  • Topics: Circuits and Systems, Electronics and Microelectronics, Instrumentation, Engineering, general, Electrical Engineering

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