Springer Series in Materials Science

Solder Joint Technology

Materials, Properties, and Reliability

Authors: Tu, King-Ning

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  • Addresses the urgent need for reliable, lead-free solders in electronic manufacturing
  • Reviews the basic science of copper-tin reactions and electromigration
  • Emphasizes reliability issues related to solder joint reaction and electromigration-induced failure in consumer electronics and computers
  • Suggests improvements in solder joint reliability and the science of solder joint behavior
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eBook $149.00
price for USA in USD (gross)
  • ISBN 978-0-387-38892-2
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  • Immediate eBook download after purchase
Hardcover $249.99
price for USA in USD
  • ISBN 978-0-387-38890-8
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  • Usually dispatched within 3 to 5 business days.
Softcover $199.99
price for USA in USD
  • ISBN 978-1-4419-2284-7
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
About this book

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

Table of contents (12 chapters)

Table of contents (12 chapters)

Buy this book

eBook $149.00
price for USA in USD (gross)
  • ISBN 978-0-387-38892-2
  • Digitally watermarked, DRM-free
  • Included format: PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $249.99
price for USA in USD
  • ISBN 978-0-387-38890-8
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $199.99
price for USA in USD
  • ISBN 978-1-4419-2284-7
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
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Bibliographic Information

Bibliographic Information
Book Title
Solder Joint Technology
Book Subtitle
Materials, Properties, and Reliability
Authors
Series Title
Springer Series in Materials Science
Series Volume
92
Copyright
2007
Publisher
Springer-Verlag New York
Copyright Holder
Springer-Verlag New York
eBook ISBN
978-0-387-38892-2
DOI
10.1007/978-0-387-38892-2
Hardcover ISBN
978-0-387-38890-8
Softcover ISBN
978-1-4419-2284-7
Series ISSN
0933-033X
Edition Number
1
Number of Pages
XVI, 370
Topics