Authors:
- Addresses the urgent need for reliable, lead-free solders in electronic manufacturing
- Reviews the basic science of copper-tin reactions and electromigration
- Emphasizes reliability issues related to solder joint reactions and electromigration induced failure in electronic consumer products and computers
- Discusses the need for and suggests improvements in solder joint reliability and the science of solder joint behavior
Part of the book series: Springer Series in Materials Science (SSMATERIALS, volume 92)
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Table of contents (12 chapters)
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Front Matter
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Introduction
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Copper—Tin Reactions
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Front Matter
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Electromigration and Thermomigration
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Front Matter
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Back Matter
About this book
Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.
Authors and Affiliations
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Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, USA
King-Ning Tu
Bibliographic Information
Book Title: Solder Joint Technology
Book Subtitle: Materials, Properties, and Reliability
Authors: King-Ning Tu
Series Title: Springer Series in Materials Science
DOI: https://doi.org/10.1007/978-0-387-38892-2
Publisher: Springer New York, NY
eBook Packages: Chemistry and Materials Science, Chemistry and Material Science (R0)
Copyright Information: Springer-Verlag New York 2007
Hardcover ISBN: 978-0-387-38890-8Published: 22 August 2007
Softcover ISBN: 978-1-4419-2284-7Published: 19 November 2010
eBook ISBN: 978-0-387-38892-2Published: 27 July 2007
Series ISSN: 0933-033X
Series E-ISSN: 2196-2812
Edition Number: 1
Number of Pages: XVI, 370
Topics: Metallic Materials, Circuits and Systems, Quality Control, Reliability, Safety and Risk, Manufacturing, Machines, Tools, Processes, Electronics and Microelectronics, Instrumentation