Integrated Circuit Packaging, Assembly and Interconnections

Authors: Greig, William

  • Delivers the information designers need to implement the best packaging approach for their specific application
  • Explains tradeoffs to be made at each level of packaging to form the most reliable product at the lowest cost
  • Identifies the IC manufacturing process (Wafer Fab) as a technology resource for the manufacture of high density interconnects
  • Highlights flip chip as the next generation first level interconnect
  • Includes a comprehensive glossary of terms
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eBook $109.00
price for USA in USD (gross)
  • ISBN 978-0-387-33913-9
  • Digitally watermarked, DRM-free
  • Included format: PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $169.99
price for USA in USD
  • ISBN 978-0-387-28153-7
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $139.99
price for USA in USD
  • ISBN 978-1-4419-3923-4
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
About this book

Integrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, serving individuals looking for an introduction, or a review, or an update of the various IC packaging, assembly, and interconnection technologies. To this end, it provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC.

The focus is on the electronic manufacturing process which, in its simplest form, involves assembly of the IC into a package or interconnect substrate or board. The book discusses the various packaging approaches available, namely, single chip, multichip, and Chip On Board; the assembly options, chip & wire, tape automated bonding, and flip chip; and the essential high density package/substrate manufacturing technologies, thin film, thick film, cofired ceramic, and laminate printed wiring board (PWB) processes. Included also is a discussion of high density PWBs using build up/sequential processes.

This material will provide a suitable knowledge-base essential for individuals who have the need or interest in understanding the basics of electronic manufacturing.

About the authors

About the Author

A graduate of Fordham University with a BS in Physics Bill has had extensive experience in Microelectronics covering semiconductor processing and assembly, Hybrid Circuits, and PWB fabrication and assembly. He began his career with RCA Semiconductor Division and subsequently worked for General Electric and Lockheed Electronics. While at RCA he was awarded six U.S. patents covering wafer processing and semiconductor assembly. At General Electric he was a staff engineer and consultant for hybrid circuits and PWB manufacturing.

As Manager of Advanced Development at Lockheed, he was directly responsible for the design, construction, and operation of a state of the art Microelectronic Packaging facility supporting research, development, and manufacture of advanced hybrid circuits and multichip modules.

He became an independent consultant in 1988. His clients have included material suppliers, assembly equipment manufacturers, and component manufacturers.

His consulting activities has included work at NASA Headquarters in Washington D.C. where he provided technical expertise and assistance in developing an Advanced Integrated Circuit Packaging and Assembly Program.

Bill specializes in packaging and assembly, focusing on high density substrate manufacturing, and chip assembly including flip chip and chip scale packaging.

His company offers assistance in technology assessment and implementation, and specializes in technical audits of manufacturing operations directed towards yield improvement and reliability enhancement.

He has developed several educational and training courses which are offered at various national and international symposia and on-site presentations.

He is an active member of IMAPS where he is a Fellow of the Society and Past President of the Garden State Chapter.

 

 

Table of contents (15 chapters)

  • Electronic Manufacturing and the Integrated Circuit

    Pages 1-14

  • Integrated Circuit Manufacturing: A Technology Resource

    Pages 15-29

  • Packaging the IC—Single Chip Packaging

    Pages 31-45

  • The Chip Scale Package

    Pages 47-59

  • Multichip Packaging

    Pages 61-80

Buy this book

eBook $109.00
price for USA in USD (gross)
  • ISBN 978-0-387-33913-9
  • Digitally watermarked, DRM-free
  • Included format: PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $169.99
price for USA in USD
  • ISBN 978-0-387-28153-7
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $139.99
price for USA in USD
  • ISBN 978-1-4419-3923-4
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
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Bibliographic Information

Bibliographic Information
Book Title
Integrated Circuit Packaging, Assembly and Interconnections
Authors
Copyright
2007
Publisher
Springer US
Copyright Holder
Springer-Verlag US
eBook ISBN
978-0-387-33913-9
DOI
10.1007/0-387-33913-2
Hardcover ISBN
978-0-387-28153-7
Softcover ISBN
978-1-4419-3923-4
Edition Number
1
Number of Pages
XXVIII, 300
Number of Illustrations and Tables
75 b/w illustrations
Topics