Overview
- A thorough professional overview on Transaction Level Modeling, with contributors from academia and industry
- Presents the formalized abstraction and related methodology of transaction level modeling
- Discusses functional verification using reference models
- The book lists several URLs for obtaining open source software that puts this approach into practice
- Includes supplementary material: sn.pub/extras
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Table of contents (7 chapters)
Keywords
About this book
Currently employed at STMicroelectronics, Transactional-Level Modeling (TLM) puts forward a novel SoC design methodology beyond RTL with measured improvements of productivity and first time silicon success.
The SystemC consortium has published the official TLM development kit in May 2005 to standardize this modeling technique. The library is flexible enough to model components and systems at many different levels of abstractions: from cycle-accurate to untimed models, and from bit-true behavior to floating-point algorithms. However, careful selection of the abstraction level and associated methodology is crucial to ensure practical gains for design teams.
Transaction-Level Modeling with SystemC presents the formalized abstraction and related methodology defined at STMicroelectronics, and covers all major topics related to the Electronic System-Level (ESL) industry:
- TLM modeling concepts
- Early embedded software development based on SoC virtual prototypes
- Functional verification using reference models
- Architecture analysis with mixed TLM and cycle accurate platforms
- Unifying TLM and RTL with platform automation tools
Complementary to the book, open source code to put this approach into practice is available on several Internet sites as indicated in the first chapter.
Editors and Affiliations
Bibliographic Information
Book Title: Transaction-Level Modeling with SystemC
Book Subtitle: TLM Concepts and Applications for Embedded Systems
Editors: Frank Ghenassia
DOI: https://doi.org/10.1007/b137175
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer-Verlag US 2005
Hardcover ISBN: 978-0-387-26232-1Published: 28 November 2005
Softcover ISBN: 978-1-4419-3875-6Published: 29 October 2010
eBook ISBN: 978-0-387-26233-8Published: 16 January 2006
Edition Number: 1
Number of Pages: XVI, 272
Topics: Electrical Engineering, Electronics and Microelectronics, Instrumentation, Engineering Design, Optical and Electronic Materials