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Nondestructive Characterization of Materials IV

Editors: Bussière, J.F., Green, Robert E., Ruud, C.O. (Eds.)

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About this book

There is a great deal of interest in extending nondestructive technologies beyond the location and identification of cracks and voids. Specifically there is growing interest in the application of nondestructive evaluation (NOEl to the measurement of physical and mechanical properties of materials. The measurement of materials properties is often referred to as materials characterization; thus nondestructive techniques applied to characterization become nondestructive characterization (NDCl. There are a number of meetings, proceedings and journals focused upon nondestructive technologies and the detection and identification of cracks and voids. However, the series of symposia, of which these proceedings represent the fourth, are the only meetings uniquely focused upon nondestructive characterization. Moreover, these symposia are especially concerned with stimulating communication between the materials, mechanical and manufacturing engineer and the NDE technology oriented engineer and scientist. These symposia recognize that it is the welding of these areas of expertise that is necessary for practical development and application of NDC technology to measurements of components for in­ service life time and sensor technology for intelligent processing of materials. These proceedings are from the fourth international symposia and are edited by c.o. Ruud, J. F. Bussiere and R.E. Green, Jr. . The dates, places, etc of the symposia held to date area as follows: Symposia on Nondestructive Methods for TITLE: Material Property Determination DATES: April 6-8, 1983 PLACE: Hershey, PA, USA CHAIRPERSONS: C.O. Ruud and R.E. Green, Jr.

Table of contents (49 chapters)

  • Accurate Structural Characterization of ZrN Coatings and Epitaxial Layers by X-Ray Diffraction Using the DOSOPHATEX System

    Fillit, R. Y. (et al.)

    Pages 1-8

  • Nondestructive Characterization of the Structure and Mechanical Properties of Metallic Superlattice Thin Films

    Schlesinger, T. E. (et al.)

    Pages 9-14

  • X-Ray Stress Studies of Aluminum Metallizations on Silicon Substrate

    Korhonen, M. A. (et al.)

    Pages 15-24

  • Micromechanical Analysis of the TiO2/Si Interface Using the Scanning Acoustic Microscope

    McCord, M. H. (et al.)

    Pages 25-31

  • Real Time Spectroscopic Ellipsometry for Non-Invasive Characterization of Thin Film Growth and Etching

    Collins, R. W. (et al.)

    Pages 33-40

Buy this book

eBook $189.00
price for USA in USD (gross)
  • ISBN 978-1-4899-0670-0
  • Digitally watermarked, DRM-free
  • Included format: PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $299.99
price for USA in USD
  • ISBN 978-0-306-44047-2
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $249.99
price for USA in USD
  • ISBN 978-1-4899-0672-4
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
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Bibliographic Information

Bibliographic Information
Book Title
Nondestructive Characterization of Materials IV
Editors
  • J.F. Bussière
  • Robert E. Green
  • C.O. Ruud
Copyright
1991
Publisher
Springer US
Copyright Holder
Springer Science+Business Media New York
eBook ISBN
978-1-4899-0670-0
DOI
10.1007/978-1-4899-0670-0
Hardcover ISBN
978-0-306-44047-2
Softcover ISBN
978-1-4899-0672-4
Edition Number
1
Number of Pages
XII, 516
Topics