Logo - springer
Slogan - springer

New & Forthcoming Titles | Electronic Packaging and Interconnects

Electronic Packaging and Interconnects

Electronic Packaging and Interconnects

ISSN: 1389-2169

Discontinued Series
Although this series no longer publishes new content, the published titles listed below may be still available on-line (e. g. via the Springer Book Archives) and in print.
  • Titles in this series

Books & CD ROMs

Show all 2 results

  • High-Frequency Characterization of Electronic Packaging
    • eBook
      Immediate eBook download after purchase

      83,29 €
      (gross)

      Hardcover
      Usually dispatched within 3 to 5 business days.

      145,59 €
      (gross)

      Softcover
      Usually dispatched within 3 to 5 business days.

      103,99 €
      (gross)
      All
    • eBook
      Immediate eBook download after purchase

      83,29 €
      (gross)

      Hardcover
      Usually dispatched within 3 to 5 business days.

      145,59 €
      (gross)

      Softcover
      Usually dispatched within 3 to 5 business days.

      103,99 €
      (gross)

    High-Frequency Characterization of Electronic Packaging

    Series: Electronic Packaging and Interconnects, Vol. 1

    Martens, Luc 1998

    Price from 83,29 €
    Available Formats:
    Information
    83,29 € (gross)
    ISBN 978-1-4615-5623-7
    Immediate eBook download after purchase
    eBook
    This title is also available as an eBook. You can pay for Springer eBooks with Visa, Mastercard, American Express or Paypal. After the purchase you can directly download the eBook file or read it online. Via MySpringer you can always re-download your eBooks.
    Information
    145,59 € (gross)
    ISBN 978-0-7923-8307-9
    Usually dispatched within 3 to 5 business days.
    Hardcover
    Hardcover version
    Information
    103,99 € (gross)
    ISBN 978-1-4613-7573-9
    Usually dispatched within 3 to 5 business days.
    Softcover
    Softcover (also known as softback) version
  • Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications
    • eBook
      Immediate eBook download after purchase

      83,29 €
      (gross)

      Hardcover
      Usually dispatched within 3 to 5 business days.

      155,99 €
      (gross)

      Softcover
      Usually dispatched within 3 to 5 business days.

      103,99 €
      (gross)
      All
    • eBook
      Immediate eBook download after purchase

      83,29 €
      (gross)

      Hardcover
      Usually dispatched within 3 to 5 business days.

      155,99 €
      (gross)

      Softcover
      Usually dispatched within 3 to 5 business days.

      103,99 €
      (gross)

    Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications

    Series: Electronic Packaging and Interconnects, Vol. 2

    Monthei, Dean L. 1999

    Price from 83,29 €
    Available Formats:
    Information
    83,29 € (gross)
    ISBN 978-1-4615-5111-9
    Immediate eBook download after purchase
    eBook
    This title is also available as an eBook. You can pay for Springer eBooks with Visa, Mastercard, American Express or Paypal. After the purchase you can directly download the eBook file or read it online. Via MySpringer you can always re-download your eBooks.
    Information
    155,99 € (gross)
    ISBN 978-0-7923-8364-2
    Usually dispatched within 3 to 5 business days.
    Hardcover
    Hardcover version
    Information
    103,99 € (gross)
    ISBN 978-1-4613-7325-4
    Usually dispatched within 3 to 5 business days.
    Softcover
    Softcover (also known as softback) version


2 of 2