Book titles in this series

  1. 3D Microelectronic Packaging

    From Architectures to Applications

    Editors:
    • Yan Li
    • Deepak Goyal
    • Copyright: 2021

    Available Renditions

    • Hard cover
    • Soft cover
    • eBook
  2. Lock-in Thermography

    Basics and Use for Evaluating Electronic Devices and Materials

    Authors:
    • Otwin Breitenstein
    • Wilhelm Warta
    • Martin C. Schubert
    • Copyright: 2018

    Available Renditions

    • Hard cover
    • eBook
  3. Microwave Electronics

    Authors:
    • Andrey D. Grigoriev
    • Vyacheslav A. Ivanov
    • Sergey I. Molokovsky
    • Copyright: 2018

    Available Renditions

    • Hard cover
    • Soft cover
    • eBook
  4. 3D Microelectronic Packaging

    From Fundamentals to Applications

    Editors:
    • Yan Li
    • Deepak Goyal
    • Copyright: 2017

    Available Renditions

    • Hard cover
    • Soft cover
    • eBook