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Materials - Optical & Electronic Materials | Journal of Electronic Materials (Editorial Board)

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Journal of Electronic Materials

Journal of Electronic Materials

Editor-in-Chief: Shadi Shahedipour-Sandvik

ISSN: 0361-5235 (print version)

Journal no. 11664


F. Shadi Shahedipour-Sandvik, SUNY Polytechnic Institute


John D. Baniecki, Fujitsu Laboratories, Japan


Wojciech Jadwisienczak, Ohio University
Tae-Kyu Lee, Portland State University
Manh-Huong Phan, University of South Florida
Dan Ricinschi, Tokyo Institute of Technology, Japan


C-P. Chang
Applied Materials, Inc.

Q. Jia
State University of New York at Buffalo

S. Mohney
The Pennsylvania State University

S. Nikzad
NASA Jet Propulsion Laboratory

B. Wessels
Northwestern University


III-V and II-VI Semiconductor Materials

John E. Ayers, University of Connecticut, Storrs, CT

 III-V As and Sb Based Materials and Devices

Ganesh Balakrishnan, University of New Mexico, Albuquerque, NM

 Crystal Growth

Ishwara Bhat, Rensselaer Polytechnic Inst., Troy, NY

 II-VI Materials and Electronic Devices, Crystallography and Defects

Gregory Brill, Army Research Laboratory, Adelphi, MD

 Interfaces and Contacts

L.J. Brillson, The Ohio State University, Columbus, OH


Arief S. Budiman, Singapore University of Technology, and Design, Singapore, Singapore

 SiC, Plasmonics, Metamaterials, Phonon, Polaritons, and Emitters

Joshua Caldwell, Vanderbilt University, Nashville, Tennessee

 Oxide and Semiconductor Device Modeling and Simulation, Optoelectronic IC, Flexible Electronic and Photonic

Parathasarathi Chakrabarti, Indian Institute of Technology, BHU, Varanasi, India

 Packaging and Interconnects

Sinn-wen Chen, National Tsing Hua University, Hsin-chu, Taiwan

 Photocatalysis, Thin Film Batteries

Tai Cheuk-Wai, Arrhenius Laboratory, Stockholm University, Stockholm, Sweden

 Thermal Management and Composite Materials

Deborah Chung, University at Buffalo, Buffalo, NY

 Interconnects and Nanocharacterization

Kathleen Dunn, SUNY Polytechnic Institute, Albany, NY

 Materials Integration

Kurt G. Eyink, Air Force Research Laboratory, WPAFB, OH

 Processing and Physical Properties of Electronic Ceramics

Tsang-Tse Fang, National Cheng Kung University, Tainan City, Taiwan

 Thermoelectric Materials and Devices, Perovskites, Energy Harvesting Systems

Armin Feldhoff, Institute of Physical Chemistry and Electrochemistry, Hannover, Germany

 Packaging and Interconnects

Darrel Frear, Freescale Semiconductor, Tempe, AZ


Zhiyong Gu, University of Massachusetts Lowell, Lowell, MA

 Computational Materials, Theory of Defects and Doping, Atomistic Modeling, Complex Functional Materials

Khang Hoang, North Dakota State University, Fargo, ND

 Electronic and Ionic Transport in Nonionic Materials

Doo Seok Jeong, Korea Institute of Science and Technology, Seoul, South Korea

 Phase Change Memory, Photonic and Optoelectronic

Pei-Cheng Ku, University of Michigan, Ann Arbor, MI

 Nano Materials; Opto/Eelectronic and Photonics

Ching-Ting Lee, National Cheng Kung University, Tainan City, Taiwan

 Interfaces, Printed Electronics, and Atomistic Simulation

Hyuck Mo Lee, Korea Advanced Institute of Science and Technology, Daejeon, South Korea

 Photovoltaics, Nuclear and THZ Detectors, and Chalcogenides

Krishna Mandal, University of South Carolina, Columbia, SC

 Solar Energy Materials, Solar Cells, and Photovoltaics

Arturo Morales-Acevedo, CINVESTAV-IPN, México, D. F., México

 Sensors, Microstructural Evolution and Packaging

Govindarajan Muralidharan, Oak Ridge National Laboratory, Oak Ridge, TN

 Nanostructured and Nanocomposite Materials, Novel Sensors

Paul R. Ohodnicki, National Energy Technology Laboratory, Pittsburgh, PA

 Compound Semiconductor and Oxide-based Materials and Devices

Jamie Phillips, University of Michigan, Ann Arbor, MI

 Thin Films and Devices

Manuel Quevedo-Lopez, University of Texas at Dallas, Richardson, TX

 Functional Materials, Energy Materials, Magneto-Mechanical and Electro-Mechanical Properties of Materials

Balaram Sahoo, Indian Institute of Science, Bangalore, India

 Microwave Properties of Dielectrics and Antennas, Dielectric Resonators

M.T. Sebastian, University of Oulu, Oulu, Finland

 Silicon-Based Heterostructures

Michael Tischler, Ocis Technology LLC, Phoenix, AZ

 III-V and II-VI Optoelectronic Devices

Jens W. Tomm, Max-Born-Institute, Berlin, Germany

 Crystalline and Amorphous Oxide Semiconductors and Devices,Combinatorial Material Science

Holger von Weckstern, Universität Leipzig, Leipzig, Germany

 Optoelectronics and Quantum Dots

Jian Xu, The Pennsylvania State University, University Park, PA

 Theoretical and Computational Physics and Chemistry, Electronic Materials for Energy Including Electrochemical and Photo-Catalytic Applications

Rui-Qin Zhang, City University of Hong Kong, Kowloon, Hong Kong SAR


Shujun Zhang, The Pennsylvania State University, University Park, PA

 2D Materials and Devices, Electrochemical and Photo-Catalytic Applications

Yuebing Zheng, University of Texas, Austin, Austin, TX

 Thermoelectric Materials, Zintl Phases, Crystal Growth of Intermetallics

Alexandra Zevelkink, Michigan State University, East Lansing, MI

For authors and editors

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  • Aims and Scope

    Aims and Scope


    The Journal of Electronic Materials reports on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, insulators, and optical and display materials. It strives to publish papers of interest to both non-specialists and specialists in the electronic materials field.

    The journal contains technical papers detailing critical new developments in the electronics field, as well as invited and contributed review papers on topics of current interest.

    There are four types of papers published in JEM:

    • Regular issue papers deal with new and original work
    • Letters are research papers
    • Reviews are lengthy papers that cover a certain area of research
    • Special Issue papers are so designated when ten or more papers on new and original research on the same topic are presented in the same issue; special section papers include six to nine papers concerned with research on the same topic.

    The Journal of Electronic Materials (JEM) reports monthly on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, dielectrics, nanoscale materials, and photonic materials. The journal welcomes articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials. Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications.

    All submissions to the Journal of Electronic Materials must be within its scope, and advance scientific knowledge by addressing important questions relevant for the research of electronic materials.  Specifically, the report should make substantial advancement in understanding properties of electronic materials and closely related disciplines. It is equally important that any submission should adhere to the highest principles of scientific ethics.

    Review papers on current topics enable individuals in the field of electronics to keep abreast of activities in areas peripheral to their own. JEM also publishes select papers from conferences such as the Electronic Materials Conference, the U.S. Workshop on the Physics and Chemistry of II-VI Materials, and the International Conference on Thermoelectrics. The journal benefits both specialists and non-specialists in the electronic materials field.

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