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Electronic Materials Letters

Electronic Materials Letters

Editor-in-Chief: Byungwoo Park

ISSN: 1738-8090 (print version)
ISSN: 2093-6788 (electronic version)

Journal no. 13391

Byungwoo Park
Department of Materials Science and Engineering
Seoul National University
Email: byungwoo@snu.ac.kr
Homepage: http://bp.snu.ac.kr/

Board of Directors
Jinho Ahn, Hanyang University, Korea
Homepage: http://msenano.hanyang.ac.kr

Ho won Jang, Seoul National University, Korea
Homepage: http://onnl.snu.ac.kr

Mijung Lee, Kookmin University, Korea
Homepage: https://mse.kookmin.ac.kr/

Byungha Shin, KAIST, Korea
Homepage: http://energymatlab.kaist.ac.kr

Sang-Im Yoo, Seoul National University, Korea
Homepage: http://emdl.snu.ac.kr/

Heon-Jin Choi, Yonsei University, Korea
Homepage: http://hjchoi.yonsei.ac.kr/

Seungwu Han, Seoul National University, Korea
Homepage: http://mtcg.snu.ac.kr

WooChul Jung, KAIST, Korea
Homepage: http://seml.kaist.ac.kr/

Kisuk Kang, Seoul National University, Korea
Homepage: http://energylab.snu.ac.kr

Taeho Moon, Dankook University, Korea
Homepage: http://user.dankook.ac.kr/~taehom/

Sung Gyu Pyo, Chung-Ang University, Korea
Homepage: http://impdl.cau.ac.kr/

Jeong-Yun Sun, Seoul National University, Korea
Homepage: http://mfsm.snu.ac.kr/index.htm

Editorial Committee
Donghwan Ahn, Kookmin University, Korea
Jong-Hyun Ahn, Yonsei University, Korea
Byung Seong Bae, Hoseo University, Korea
Jeong Min Baik, UNIST, Korea
Jinhan Cho, Korea University, Korea
Young-Rae Cho, Pusan National University, Korea
Changhwan Choi, Hanyang University, Korea
In-Suk Choi, KIST, Korea
Ki-Ha Hong, Hanbat National University, Korea
Soon-Ku Hong, Chonnam National University, Korea
Yongtaek Hong, Seoul National University, Korea
Pyungwoo Jang, Cheongju University, Korea
Koochul Je, Anyang University, Korea
Minhyon Jeon, Inje University, Korea
Seokwoo Jeon, KAIST, Korea
Unyong Jeong, Yonsei University, Korea
Sungjin Jo, Kyungpook National University, Korea
Heesoo Jung, Agency for Defense Development, Korea
Hyun Suk Jung, Sungkyunkwan University, Korea
Yeon Sik Jung, KAIST, Korea
Hyungjun Kim, Yonsei University, Korea
Jin Hyeok Kim, Chonnam National University, Korea
Jong Kyu Kim, POSTECH, Korea
Ki-Soo Kim, Ulsan Technopark, Korea
Sang Sub Kim, Inha University, Korea
Sang-Woo Kim, Sungkyunkwan University, Korea
Sarah Eunkyung Kim, Seoul National University of Science and Technology, Korea
Soo Young Kim, Chung-Ang University, Korea
Woong Kim, Korea University, Korea
Jang Hyuk Kwon, Kyung Hee University, Korea
Sung-Ku Kwon, Kunsan National University, Korea
Jae-Seung Lee, Korea University, Korea
Byoung Hun Lee, GIST, Korea
Caroline Sunyoung Lee, Hanyang University, Korea
Han-Bo-Ram Lee, Incheon National University, Korea
Hee Chul Lee, Korea Polytechnic University, Korea
Jang-Sik Lee, POSTECH, Korea
Jongwon Lee, Hanbat National University, Korea
June Hyuk Lee, KAERI, Korea
Keon Jae Lee, KAIST, Korea
Nae-Eung Lee, Sungkyunkwan University, Korea
Seung Mi Lee, KRISS, Korea
Seung-Cheol Lee, KIST, Korea
Won-Jun Lee, Sejong University, Korea
Ho-Seok Nam, Seoul National University, Korea
Ki Tae Nam, Seoul National University, Korea
Jihun Oh, KAIST, Korea
Soong Ju Oh, Korea University, Korea
Yong Jun Oh, Hanbat National University, Korea
Cheolmin Park, Yonsei University, Korea
Jin-Seong Park, Hanyang University, Korea
Sungkyu Park, Chung-Ang University, Korea
Won Il Park, Hanyang University, Korea
Young-Bae Park, Andong National University, Korea
Bong-Ki Ryu, Pusan National University, Korea
Haein Yim, Sookmyung Women's University, Korea
Sehoon Yoo, KITECH, Korea

International Advisory Board
Ahmed Busnaina, Northeastern University, USA
Chang-Beom Eom, University of Wisconsin-Madison, USA
Sumio Iijima, Meijo University, Japan
Seung H. Kang, Qualcomm, USA
Jiyoung Kim, University of Texas at Dallas, USA
Choong-Un Kim, University of Texas at Arlington, USA
Jun-ichi Koike, Tohoku University, Japan
Shinji Matsui, Univeristy of Hyogo, Japan
Seung Chul Song, Texas Instruments, USA
Masakazu Sugiyama, The University of Tohoku, Japan
Koki Tajanashi, Tohoku University, Japan
Chih-Chung Yang, National Taiwan University, Taiwan

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    Electronic Materials Letters is an official journal of the Korean Institute of Metals and Materials. It is a peer-reviewed international journal publishing print and online version. It covers all disciplines of research and technology in electronic materials. Emphasis is placed on science, engineering and applications of advanced materials, including electronic, magnetic, optical, organic, electrochemical, mechanical, and nanoscale materials. The aspects of synthesis and processing include thin films, nanostructures, self assembly, and bulk, all related to thermodynamics, kinetics and/or modeling.

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