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Particles in Contact

Micro Mechanics, Micro Process Dynamics and Particle Collective

  • Book
  • © 2019

Overview

Editors:
  1. Sergiy Antonyuk

    1. Institute of Particle Process Engineering, Technische Universität Kaiserslautern, Kaiserslautern, Germany

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  • Presents the latest scientific findings in the area of granular materials, their physical fundamentals and applications in particle technology

  • Lists the research results obtained as part of a joint international research project cluster of 24 cooperating universities supported by German Research Foundation during last 7 years

  • Covers the current state of research in the field of particle technology focused on the description of interactions of fine adhesive particles

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Table of contents (21 chapters)

  1. Front Matter

    Pages i-xi
    Download chapter PDF

  2. Analysis of Adsorbates and Interfacial Forces at Metal Oxide Interfaces at Defined Environmental Conditions

    • A. G. Orive, C. Kunze, B. Torun, T. de los Arcos, G. Grundmeier
    Pages 1-30

  3. Understanding and Manipulation of Nanoparticle Contact Forces by Capillary Bridges

    • Hans-Joachim Schmid, Guido Grundmeier, Michael Dörmann, Alejandro González Orive, Teresa de los Arcos, Boray Torun
    Pages 31-65

  4. Microwave Emission During the Impact Compaction of Particle Bed

    • Sergej Aman, Alexander Aman, Werner Hintz
    Pages 67-87

  5. Formation, Deformation, Rolling and Sliding of Particles and Particle Aggregates: Mechanisms and Applications

    • Laurent Gilson, Jennifer Wenzl, Maxime Paven, Michael Kappl, Hans-Jürgen Butt, Doris Vollmer et al.
    Pages 89-114

  6. Contact Models and DEM Simulation of Micrometer-Sized Particles and Agglomerates at Static Loading Based on Experimental Characterization

    • Philipp Grohn, Dominik Weis, Ulrich Bröckel, Stefan Heinrich, Sergiy Antonyuk
    Pages 115-163

  7. DEM Analysis of Breakage Behavior of Bicomponent Agglomerates

    • Maksym Dosta, Matthias Weber, Volker Schmidt, Sergiy Antonyuk
    Pages 165-183

  8. Contact Mechanisms in Ultrasound-Agitated Particulate Systems

    • Claas Knoop, Tobias Wollborn, Udo Fritsching
    Pages 185-237

  9. Capillary Interaction in Wet Granular Assemblies: Part 1

    • Stephan Herminghaus, Ciro Semprebon, Martin Brinkmann
    Pages 239-275

  10. Capillary Interaction in Wet Granular Assemblies: Part 2

    • Falk K. Wittel, Roman Mani, Konstantin Melnikov, Filippo Bianchi, Hans J. Herrmann
    Pages 277-309

  11. Sintering—Pressure- and Temperature-Dependent Contact Models

    • T. Weinhart, R. Fuchs, T. Staedler, M. Kappl, S. Luding
    Pages 311-338

  12. A Contact Model for the Discrete Element Simulations of Aggregated Nanoparticle Films

    • Valentin Baric, Jens Laube, Samir Salameh, Lucio Colombi Ciacchi, Lutz Mädler
    Pages 339-358

  13. Determination of the Adhesion Forces of Magnetic Composite Particles

    • Johannes Knoll, Frank Rhein, Hermann Nirschl
    Pages 359-384

  14. Deformation and Friction at the Microscale—From Model Experiments to Process Characterization

    • Wolfgang Peukert, Stefan Romeis
    Pages 385-415

  15. Measurement of the Adhesion Moment of a Particle on a Wall in a Gaseous Environment and Comparison to Simulated Data

    • Alexander Haarmann, Eberhard Schmidt
    Pages 417-436

  16. Nanoindentation Based Colloid Probe Technique: A Unique Opportunity to Study the Mechanical Contact of Individual Micron Sized Particles

    • Thorsten Staedler, Katharina Diehl, Regina Fuchs, Jan Meyer, Aditya Kumar, Xin Jiang
    Pages 437-455

  17. The Importance of Interactions Between Carrier and Drug Particles for the Application in Dry Powder Inhalers

    • Sarah Zellnitz, Niklas Renner, Yan Cui, Regina Scherließ, Martin Sommerfeld, Hartwig Steckel et al.
    Pages 457-516

  18. Rapid Impact of Nanoparticles on Surfaces

    • Alfred Weber, Christian Schöner, Manuel Gensch, Alexander Werner, Thorsten Pöschel
    Pages 517-563

  19. Stochastic Nature of Particle Collisions and its Impact on Granular Material Properties

    • Nina Gunkelmann, Dan Serero, Aldo Glielmo, Marina Montaine, Michael Heckel, Thorsten Pöschel
    Pages 565-590

  20. Non-ohmic Properties of Particle Layers in Electrostatic Precipitators

    • Damian Pieloth, Helmut Wiggers, Peter Walzel
    Pages 591-606
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Keywords

About this book

This book contains the latest scientific findings in the area of granular materials, their physical fundamentals and applications in particle technology focused on the description of interactions of fine adhesive particles.In collaboration between physicists, chemists, mathematicians and mechanics and process engineers from 24 universities, new theories and methods for multiscale modeling and reliable measurement of particles are developed, with a focus on:
• Basic physical-chemical processes in the contact zone: particle-particle and particle-wall contacts,
• Particle collisions and their dynamics• Constitutive material laws for particle systems on the macro level.

Editors and Affiliations

  • Institute of Particle Process Engineering, Technische Universität Kaiserslautern, Kaiserslautern, Germany

    Sergiy Antonyuk

About the editor

Sergiy Antonyuk  is a Professor and Head of the Institute of Particle Process Engineering at the Technische Universität Kaiserslautern, Germany. 

Bibliographic Information

  • Book Title: Particles in Contact

  • Book Subtitle: Micro Mechanics, Micro Process Dynamics and Particle Collective

  • Editors: Sergiy Antonyuk

  • DOI: https://doi.org/10.1007/978-3-030-15899-6

  • Publisher: Springer Cham

  • eBook Packages: Chemistry and Materials Science, Chemistry and Material Science (R0)

  • Copyright Information: Springer Nature Switzerland AG 2019

  • Hardcover ISBN: 978-3-030-15898-9Published: 14 August 2019

  • Softcover ISBN: 978-3-030-15901-6Published: 15 August 2020

  • eBook ISBN: 978-3-030-15899-6Published: 31 July 2019

  • Edition Number: 1

  • Number of Pages: XI, 662

  • Number of Illustrations: 148 b/w illustrations, 314 illustrations in colour

  • Topics: Surfaces and Interfaces, Thin Films, Classical Electrodynamics, Materials Engineering

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