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Integrated Circuit Packaging, Assembly and Interconnections

Authors: Greig, William

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  • Delivers the information designers need to implement the best packaging approach for their specific application
  • Explains tradeoffs to be made at each level of packaging to form the most reliable product at the lowest cost
  • Identifies the IC manufacturing process (Wafer Fab) as a technology resource for the manufacture of high density interconnects
  • Highlights flip chip as the next generation first level interconnect
  • Includes a comprehensive glossary of terms
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書籍の購入

イーブック ¥12,595
価格の適用国: Japan (日本円価格は個人のお客様のみ有効) (小計)
  • ISBN 978-0-387-33913-9
  • ウォーターマーク付、 DRMフリー
  • ファイル形式: PDF
  • どの電子書籍リーダーからでもすぐにお読みいただけます。
  • ご購入後、すぐにダウンロードしていただけます。
ハードカバー ¥19,655
価格の適用国: Japan (日本円価格は個人のお客様のみ有効) (小計)
  • ISBN 978-0-387-28153-7
  • 個人のお客様には、世界中どこでも配送料無料でお届けします。
  • Usually dispatched within 3 to 5 business days.
ソフトカバー ¥15,744
価格の適用国: Japan (日本円価格は個人のお客様のみ有効) (小計)
  • ISBN 978-1-4419-3923-4
  • 個人のお客様には、世界中どこでも配送料無料でお届けします。
  • Usually dispatched within 3 to 5 business days.
この書籍について

Integrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, serving individuals looking for an introduction, or a review, or an update of the various IC packaging, assembly, and interconnection technologies. To this end, it provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC.

The focus is on the electronic manufacturing process which, in its simplest form, involves assembly of the IC into a package or interconnect substrate or board. The book discusses the various packaging approaches available, namely, single chip, multichip, and Chip On Board; the assembly options, chip & wire, tape automated bonding, and flip chip; and the essential high density package/substrate manufacturing technologies, thin film, thick film, cofired ceramic, and laminate printed wiring board (PWB) processes. Included also is a discussion of high density PWBs using build up/sequential processes.

This material will provide a suitable knowledge-base essential for individuals who have the need or interest in understanding the basics of electronic manufacturing.

著者について

About the Author

A graduate of Fordham University with a BS in Physics Bill has had extensive experience in Microelectronics covering semiconductor processing and assembly, Hybrid Circuits, and PWB fabrication and assembly. He began his career with RCA Semiconductor Division and subsequently worked for General Electric and Lockheed Electronics. While at RCA he was awarded six U.S. patents covering wafer processing and semiconductor assembly. At General Electric he was a staff engineer and consultant for hybrid circuits and PWB manufacturing.

As Manager of Advanced Development at Lockheed, he was directly responsible for the design, construction, and operation of a state of the art Microelectronic Packaging facility supporting research, development, and manufacture of advanced hybrid circuits and multichip modules.

He became an independent consultant in 1988. His clients have included material suppliers, assembly equipment manufacturers, and component manufacturers.

His consulting activities has included work at NASA Headquarters in Washington D.C. where he provided technical expertise and assistance in developing an Advanced Integrated Circuit Packaging and Assembly Program.

Bill specializes in packaging and assembly, focusing on high density substrate manufacturing, and chip assembly including flip chip and chip scale packaging.

His company offers assistance in technology assessment and implementation, and specializes in technical audits of manufacturing operations directed towards yield improvement and reliability enhancement.

He has developed several educational and training courses which are offered at various national and international symposia and on-site presentations.

He is an active member of IMAPS where he is a Fellow of the Society and Past President of the Garden State Chapter.

 

 

Table of contents (15 chapters)

Table of contents (15 chapters)

書籍の購入

イーブック ¥12,595
価格の適用国: Japan (日本円価格は個人のお客様のみ有効) (小計)
  • ISBN 978-0-387-33913-9
  • ウォーターマーク付、 DRMフリー
  • ファイル形式: PDF
  • どの電子書籍リーダーからでもすぐにお読みいただけます。
  • ご購入後、すぐにダウンロードしていただけます。
ハードカバー ¥19,655
価格の適用国: Japan (日本円価格は個人のお客様のみ有効) (小計)
  • ISBN 978-0-387-28153-7
  • 個人のお客様には、世界中どこでも配送料無料でお届けします。
  • Usually dispatched within 3 to 5 business days.
ソフトカバー ¥15,744
価格の適用国: Japan (日本円価格は個人のお客様のみ有効) (小計)
  • ISBN 978-1-4419-3923-4
  • 個人のお客様には、世界中どこでも配送料無料でお届けします。
  • Usually dispatched within 3 to 5 business days.
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書誌情報

Bibliographic Information
Book Title
Integrated Circuit Packaging, Assembly and Interconnections
Authors
Copyright
2007
Publisher
Springer US
Copyright Holder
Springer-Verlag US
イーブック ISBN
978-0-387-33913-9
DOI
10.1007/0-387-33913-2
ハードカバー ISBN
978-0-387-28153-7
ソフトカバー ISBN
978-1-4419-3923-4
Edition Number
1
Number of Pages
XXVIII, 300
Number of Illustrations
75 b/w illustrations
Topics