Nanomanufacturing and Metrology - Call for Papers
Chief guest editor:
Ir Prof. Benny C.F. Cheung
The Hong Kong Polytechnic University, HKSAR, China
benny.cheung@polyu.edu.hk (this opens in a new tab)
Special Issue Information:
The CHINA-JAPAN International Conference on Ultra-Precision Machining Process (CJUMP) was initiated in 1984. The CJUMP2023 will be held in China, during 21st-23rd October 2023. The goal of the conference is to bring together researchers and academics from China and Japan to discuss novel theories, technologies and applications in the areas of precision engineering, micro engineering and nano-technology. This special issue aims to bring together the new situation of ultra-precision machining and surface finishing technology which cover a wide range of new developments for process technology on machine tool, instruments and metrology in precision measurement, micro and nano-machining. The topics include but are not limited to:
- High speed and efficiency manufacturing
- Semiconductor manufacturing and testing
- Nano and micro machining
- New energy and sustainable manufacturing
- Ultra-precision abrasive machining
- Intelligent precision manufacturing
- Single-point diamond cutting
- Additive manufacturing
- Ultra-precision mechanical design
- Advanced optics manufacturing
- Machine tools and their systems
- Micro/nano structures for energy / biomedical applications
- Coolant and cooling
- Sensors and instrumentations
- In-situ measurement and monitoring
- Robotic based manufacturing
- Ultra-precision surface measurement
- Atomic and close-to-atomic scale manufacturing (ACSM)
Original research papers, review articles and short communications are all welcome
All manuscripts must be submitted through the manuscripts system at:
https://www.editorialmanager.com/nanm/default.aspx (this opens in a new tab)
Manuscript submission information:
Manuscript submission deadline: 20 October 2023 (papers will be published once accepted, earliest from January 2024).
You are invited to submit your manuscript at any time before the submission deadline.
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