Editors
Editor-in-Chief
Nadia Magnenat-Thalmann
MIRALab-CUI
University of Geneva
Battelle, Building A
7, Route de Drize
CH-1227 Carouge, Geneva, Switzerland
thalmann@miralab.ch
http://www.miralab.ch/
Associate Editor-in-Chief
Nannan Wang
Xidian University, China, nnwang@xidian.edu.cn
Founding Editor
Tosiyasu L. Kunii
Editorial Board
Antonio Agudo
Institut de Robòtica i Informàtica industrial, CSIC-UPC, Spain, antonio.agudo@upc.edu
Daniel G. Aliaga
Purdue University, USA, aliaga@cs.purdue.edu
Yiannis Aloimonos
University of Maryland, USA, yiannis@cs.umd.edu
Alessia Amelio
University "G. d'Annunzio" Chieti-Pescara, Italy, alessia.amelio@unich.it
Nantheera (Pui) Anantrasirichai
University of Bristol, UK, N.Anantrasirichai@bristol.ac.uk
Andreas Aristidou
University of Cyprus, a.aristidou@ieee.org
Selim Balcisoy
Sabanci University, Istanbul, Turkey, balcisoy@sabanciuniv.edu
Francisco Barranco
University of Granada, Spain, fbarranco@ugr.es
Nicolas Bonneel
CNRS/Univ. Lyon, France, nicolas.bonneel@liris.cnrs.fr
Katja Bühler
VRVis Zentrum für Virtual Reality und Visualisierung Forschungs-GmbH, Austria, buehler@vrvis.at
Yiyu Cai
Nanyang Technological University, Singapore, myycai@ntu.edu.sg
Tolga Çapın
TED University, Turkey, tolga.capin@tedu.edu.tr
Lap-Pui Chau
Nanyang Technological University, Singapore, elpchau@ntu.edu.sg
Jie Chen
Hong Kong Baptist University, chenjie@comp.hkbu.edu.hk
Renjie Chen
Max-Planck Institute for Informatics, Germany, renjie.chen@mpi-inf.mpg.de
Zhonggui Chen
School of Informatics, Xiamen University, China, chenzhonggui@xmu.edu.cn
De Cheng
Xidian University, China, dcheng@xidian.edu.cn
Sunghyun Cho
POSTECH, Republic of Korea, s.cho@postech.ac.kr
Frederic Cordier
University of Haute Alsace and University of Strasbourg, France, Frederic.Cordier@uha.fr
Massimiliano Corsini
Istituto Scienza e Tecnologia dell'Informazione "A. Faedo", Italy, massimiliano.corsini@isti.cnr.it
Rémi Cozot
LISIC, France, remi.cozot@univ-littoral.fr
Zhaopeng Cui
ETH Zurich, Switzerland, zhpcui@gmail.com
Naser Damer
Fraunhofer IGD, Germany, Naser.Damer@igd.fraunhofer.de
Jan De Beenhouwer
University of Antwerp, Belgium, jan.debeenhouwer@uantwerpen.be
Wanxia Deng
National University of Defense Technology (NUDT), China, dengwanxia14@nudt.edu.cn
Jean-Michel Dischler
University of Strasbourg, France, dischler@unistra.fr
Parris K. Egbert
Brigham Young University, USA, egbert@cs.byu.edu
Jan Egger
Graz University of Technology, and Medical University of Graz, Austria, egger@tugraz.at
Petros Faloutsos
York University, Canada, pfal@cse.yorku.ca
Bin Fan
University of Science and Technology Beijing, China, bin.fan@ieee.org
Cornelia Fermuller
University of Maryland, USA, fer@umiacs.umd.edu
Antonino Furnari
University of Catania, Italy, furnari@dmi.unict.it
Chenqiang Gao
Chongqing University of Posts and Telecommunications, China, gaocq@cqupt.edu.cn
Fei Gao
Xidian University, China, gaofeihifly@gmail.com
Xifeng Gao
Florida State University, USA, gxf.xisha@gmail.com
Marina Gavrilova
University of Calgary, Canada, mgavrilo@ucalgary.ca
Ioannis Gkioulekas
Carnegie Mellon University, USA, igkioule@cs.cmu.edu
Enrico Gobbetti
The Center for Advanced Studies, Research and Development in Sardinia, Italy, gobbetti@crs4.it
Marcin Grzegorzek
Universität zu Lübeck, Germany, grzegorzek@imi.uni-luebeck.de
Shuhang Gu
ETH Zurich, Switzerland, shuhanggu@gmail.com
Frank Guan
Singapore Institute of Technology, frank.guan@singaporetech.edu.sg
Zhenhua Guo
Alibaba Group, China, cszguo@gmail.com
Junhui Hou
City University of Hong Kong, jh.hou@cityu.edu.hk
Peng Hu
Sichuan University, China, Penghu.ml@gmail.com
Ruizhen Hu
Shenzhen University, China, ruizhen.hu@gmail.com
Haibin Huang
Kuaishou Technology, USA, jackiehuanghaibin@gmail.com
Hua Huang
Beijing Institute of Technology, China, huahuang@bit.edu.cn
Junjun Jiang
Harbin Institute of Technology, China, jiangjunjun@hit.edu.cn
Jinbo Jiao
University of Birmingham, UK, j.jiao@bham.ac.uk
Dakai Jin
PAII Inc., USA, dakai.jin@gmail.com
Younhyun Jung
Gachon University, Republic of Korea, younhyun.jung@gachon.ac.kr
Ramakrishna Kakarala
Omnivision Technologies, Inc., USA, ram.kakarala@ovt.com
Prem Kalra
Indian Institute of Technology, Delhi, India, pkalra@cse.iitd.ernet.in
Daniel Keim
University of Konstanz, Germany, keim@uni-konstanz.de
Jinman Kim
University of Sydney, Australia, jinman.kim@sydney.edu.au
George Alex Koulieris
Durham University, UK, georgios.a.koulieris@durham.ac.uk
Walter Kropatsch
Vienna University of Technology, Austria, krw@prip.tuwien.ac.at
Arjan Kuijper
Fraunhofer IGD & TU Darmstadt, Germany, arjan.kuijper@igd.fraunhofer.de
Yu-Kun Lai
Cardiff University, UK, LaiY4@cardiff.ac.uk
Jean-François Lalonde
Université Laval, Canada, jean-francois.lalonde@gel.ulaval.ca
Guanbin Li
Sun Yat-sen University, China, liguanbin@mail.sysu.edu.cn
Zechao Li
Nanjing University of Science and Technology, zechao.li@njust.edu.cn
Xiaodan Liang
Sun Yat-sen University, China, xdliang328@gmail.com
Di Lin
Shenzhen University, China, ande.lin1988@gmail.com
Ligang Liu
University of Science and Technology of China, lgliu@ustc.edu.cn
Risheng Liu
Dalian University of Technology, China, rsliu@dlut.edu.cn
Xuequan Lu
Deakin University, Australia, xuequan.lu@deakin.edu.au
Yong Luo
Wuhan University, China, luoyong@whu.edu.cn
Bingpeng Ma
University of Chinese Academy of Sciences, China, bpma@ucas.ac.cn
Luca Magri
Politecnico di Milano, Italy, luca.magri@polimi.it
Xiaoyang Mao
University of Yamanashi, Japan, mao@yamanashi.ac.jp
Iacopo Masi
Sapienza, University of Rome, Italy, masi@di.uniroma1.it
Stefano Mattoccia
University of Bologna, Italy, stefano.mattoccia@unibo.it
Fanman Meng
University of Electronic Science and Technology of China, fmmeng@uestc.edu.cn
Jingjing Meng
University at Buffalo, the State University of New York, USA, jingjing.meng1@gmail.com
Bochang Moon
Gwangju Institute of Science and Technology, Republic of Korea, moonbochang@gmail.com
Michela Mortara
IMATI-CNR Genova, Italy, michela.mortara@ge.imati.cnr.it
Anirban Mukhopadhyay
Technische Universität Darmstadt, Germany, anirban.mukhopadhyay@gris.informatik.tu-darmstadt.de
Ahmad H. Nasri
Lebanese National Council for Scientific Research, Lebanon, anasri.82@gmail.com
Luciana Porcher Nedel
Universidade Federal do Rio Grande do Sul, Porto Alegre, Brazil, nedel@inf.ufrgs.br
Tae-Hyun Oh
POSTECH, Republic of Korea, taehyun@postech.ac.kr
Victor Ostromoukhov
Claude Bernard University of Lyon 1, France, victor.ostromoukhov@liris.cnrs.fr
Jinshan Pan
Nanjing University of Science and Technology, China, sdluran@gmail.com
George Papagiannakis
University of Crete, Greece, papagian@ics.forth.gr
Chunlei Peng
Xidian University, China, clpeng@xidian.edu.cn
Xi Peng
Sichuan University, China, pengxi@scu.edu.cn
Andrea Prati
Università degli Studi di Parma, Italy, andrea.prati@unipr.it
Jianjun Qian
Nanjing University of Science and Technology (NUST), China, csjqian@njust.edu.cn
Jianfeng Ren
University of Nottingham Ningbo China, Jianfeng.Ren@nottingham.edu.cn
Zhou Ren
Wormpex AI Research, USA, renzhou200622@gmail.com
Jonathan Roberts
Bangor University, UK, j.c.roberts@bangor.ac.uk
Robert Sablatnig
Wien Technical University, Austria, sab@cvl.tuwien.ac.at
Filip Sadlo
University of Heidelberg, Germany, sadlo@uni-heidelberg.de
Yusuf Sahillioğlu
Middle East Technical University, Turkey, ys@ceng.metu.edu.tr
Gerik Scheuermann
University of Leipzig, Germany, scheuer@informatik.uni-leipzig.de
Thomas Schultz
University of Bonn, Germany, schultz@cs.uni-bonn.de
Hyewon Seo
CNRS and University of Strasbourg, France, seo@unistra.fr
Tianjia Shao
Zhejiang University, China, tjshao@zju.edu.cn
Bin Sheng
Shanghai Jiao Tong University, China, shengbin@cs.sjtu.edu.cn
Xiangbo Shu
Nanjing University of Science and Technology, China, shuxb@njust.edu.cn
Leonid Sigal
University of British Columbia, Canada, lsigal@cs.ubc.ca
Oh-young Song
Sejong University, Seoul, Republic of Korea, oysong@sejong.ac.kr
Alexei Sourin
Nanyang Technological University, Singapore, assourin@ntu.edu.sg
Michela Spagnuolo
IMATI-CNR, Genova, Italy, michela.spagnuolo@ge.imati.cnr.it
Xian Sun
Chinese Academy of Sciences, China, sunxian@aircas.ac.cn
Jinhui Tang
Nanjing University of Science and Technology, China, jinhuitang@njust.edu.cn
Daniel Thalmann
EPFL, Switzerland, daniel.thalmann@epfl.ch
Bernie Tiddeman
Aberystwyth University, UK, bpt@aber.ac.uk
Zhigang Tu
Wuhan University, China, tuzhigang@whu.edu.cn
Hongcheng Wang
Comcast Labs, USA, Hongcheng.Wang@gmail.com
Huamin Wang
The Ohio State University, USA, whmin@cse.ohio-state.edu
Keze Wang
DMAI Co., Ltd, China, kezewang@gmail.com
Weiming Wang
Hong Kong Metropolitan University, wmwang@hkmu.edu.hk
Mingqiang Wei
Nanjing University of Aeronautics and Astronautics, China, mqwei@nuaa.edu.cn
Franz-Erich Wolter
Leibniz Universität Hannover, Germany, few@gdv.uni-hannover.de
Tien-Tsin Wong
Chinese University of Hong Kong, ttwong@cse.cuhk.edu.hk
Chunlin Wu
Nankai University, China, wucl@nankai.edu.cn
Kevin Xu
National University of Defense Technology (NUDT), China, kevin.kai.xu@gmail.com
Kun Xu
Tsinghua University, China, xukun@tsinghua.edu.cn
Dongmin Yan
Chinese Academy of Sciences, China, yandongming@gmail.com
Wankou Yang
Southeast University, China, wkyang@seu.edu.cn
Xi Yang
Xidian University, China, yangx@xidian.edu.cn
Yücel Yemez
Koç University, Turkey, YYEMEZ@ku.edu.tr
Junsong Yuan
University of Buffalo, USA, jsyuan@buffalo.edu
Shanxin Yuan
Huawei Technologies Research & Development (UK) Ltd, shanxinyuan@gmail.com
Gabriel Zachmann
University of Bremen, Germany, zach@cs.uni-bremen.de
Pietro Zanuttigh
University of Padova, Italy, zanuttigh@dei.unipd.it
Dingwen Zhang
Northwestern Polytechnical University, China, zdw2006yyy@nwpu.edu.cn
Hua Zhang
Chinese Academy of Sciences, China, zhanghua@iie.ac.cn
Jian J Zhang
Bournemouth University, UK, jzhang@bournemouth.ac.uk
Kaibing Zhang
Xi’an Polytechnic University, China, zhangkaibing@xpu.edu.cn
Kang Zhang
University of Texas at Dallas, USA, kzhang@utdallas.edu
Lei Zhang
Beijing Institute of Technology, China, leizhang@bit.edu.cn
Mingjin Zhang
Xidian University, China, mjinzhang@xidian.edu.cn
Qianni Zhang
Queen Mary University of London, UK, qianni.zhang@qmul.ac.uk
Jianmin Zheng
Nanyang Technological University, Singapore, ASJMZheng@ntu.edu.sg
Wenming Zheng
Southeast University, China, wenming_zheng@seu.edu.cn
Youyi Zheng
Zhejiang University, China, youyizheng@zju.edu.cn
Shuaifeng Zhi
National University of Defense Technology (NUDT), China, zhishuaifeng11@nudt.edu.cn
Hongyuan Zhu
Institute for Infocomm Research, A*STAR, Singapore, zhuh@i2r.a-star.edu.sg
Changqing Zou
Zhejiang University, China, aaronzou1125@gmail.com
Wangmeng Zuo
Harbin Institute of Technology, China, wmzuo@hit.edu.cn
Nadia Magnenat-Thalmann
MIRALab-CUI
University of Geneva
Battelle, Building A
7, Route de Drize
CH-1227 Carouge, Geneva, Switzerland
thalmann@miralab.ch
http://www.miralab.ch/
Associate Editor-in-Chief
Nannan Wang
Xidian University, China, nnwang@xidian.edu.cn
Founding Editor
Tosiyasu L. Kunii
Editorial Board
Antonio Agudo
Institut de Robòtica i Informàtica industrial, CSIC-UPC, Spain, antonio.agudo@upc.edu
Daniel G. Aliaga
Purdue University, USA, aliaga@cs.purdue.edu
Yiannis Aloimonos
University of Maryland, USA, yiannis@cs.umd.edu
Alessia Amelio
University "G. d'Annunzio" Chieti-Pescara, Italy, alessia.amelio@unich.it
Nantheera (Pui) Anantrasirichai
University of Bristol, UK, N.Anantrasirichai@bristol.ac.uk
Andreas Aristidou
University of Cyprus, a.aristidou@ieee.org
Selim Balcisoy
Sabanci University, Istanbul, Turkey, balcisoy@sabanciuniv.edu
Francisco Barranco
University of Granada, Spain, fbarranco@ugr.es
Nicolas Bonneel
CNRS/Univ. Lyon, France, nicolas.bonneel@liris.cnrs.fr
Katja Bühler
VRVis Zentrum für Virtual Reality und Visualisierung Forschungs-GmbH, Austria, buehler@vrvis.at
Yiyu Cai
Nanyang Technological University, Singapore, myycai@ntu.edu.sg
Tolga Çapın
TED University, Turkey, tolga.capin@tedu.edu.tr
Lap-Pui Chau
Nanyang Technological University, Singapore, elpchau@ntu.edu.sg
Jie Chen
Hong Kong Baptist University, chenjie@comp.hkbu.edu.hk
Renjie Chen
Max-Planck Institute for Informatics, Germany, renjie.chen@mpi-inf.mpg.de
Zhonggui Chen
School of Informatics, Xiamen University, China, chenzhonggui@xmu.edu.cn
De Cheng
Xidian University, China, dcheng@xidian.edu.cn
Sunghyun Cho
POSTECH, Republic of Korea, s.cho@postech.ac.kr
Frederic Cordier
University of Haute Alsace and University of Strasbourg, France, Frederic.Cordier@uha.fr
Massimiliano Corsini
Istituto Scienza e Tecnologia dell'Informazione "A. Faedo", Italy, massimiliano.corsini@isti.cnr.it
Rémi Cozot
LISIC, France, remi.cozot@univ-littoral.fr
Zhaopeng Cui
ETH Zurich, Switzerland, zhpcui@gmail.com
Naser Damer
Fraunhofer IGD, Germany, Naser.Damer@igd.fraunhofer.de
Jan De Beenhouwer
University of Antwerp, Belgium, jan.debeenhouwer@uantwerpen.be
Wanxia Deng
National University of Defense Technology (NUDT), China, dengwanxia14@nudt.edu.cn
Jean-Michel Dischler
University of Strasbourg, France, dischler@unistra.fr
Parris K. Egbert
Brigham Young University, USA, egbert@cs.byu.edu
Jan Egger
Graz University of Technology, and Medical University of Graz, Austria, egger@tugraz.at
Petros Faloutsos
York University, Canada, pfal@cse.yorku.ca
Bin Fan
University of Science and Technology Beijing, China, bin.fan@ieee.org
Cornelia Fermuller
University of Maryland, USA, fer@umiacs.umd.edu
Antonino Furnari
University of Catania, Italy, furnari@dmi.unict.it
Chenqiang Gao
Chongqing University of Posts and Telecommunications, China, gaocq@cqupt.edu.cn
Fei Gao
Xidian University, China, gaofeihifly@gmail.com
Xifeng Gao
Florida State University, USA, gxf.xisha@gmail.com
Marina Gavrilova
University of Calgary, Canada, mgavrilo@ucalgary.ca
Ioannis Gkioulekas
Carnegie Mellon University, USA, igkioule@cs.cmu.edu
Enrico Gobbetti
The Center for Advanced Studies, Research and Development in Sardinia, Italy, gobbetti@crs4.it
Marcin Grzegorzek
Universität zu Lübeck, Germany, grzegorzek@imi.uni-luebeck.de
Shuhang Gu
ETH Zurich, Switzerland, shuhanggu@gmail.com
Frank Guan
Singapore Institute of Technology, frank.guan@singaporetech.edu.sg
Zhenhua Guo
Alibaba Group, China, cszguo@gmail.com
Junhui Hou
City University of Hong Kong, jh.hou@cityu.edu.hk
Peng Hu
Sichuan University, China, Penghu.ml@gmail.com
Ruizhen Hu
Shenzhen University, China, ruizhen.hu@gmail.com
Haibin Huang
Kuaishou Technology, USA, jackiehuanghaibin@gmail.com
Hua Huang
Beijing Institute of Technology, China, huahuang@bit.edu.cn
Junjun Jiang
Harbin Institute of Technology, China, jiangjunjun@hit.edu.cn
Jinbo Jiao
University of Birmingham, UK, j.jiao@bham.ac.uk
Dakai Jin
PAII Inc., USA, dakai.jin@gmail.com
Younhyun Jung
Gachon University, Republic of Korea, younhyun.jung@gachon.ac.kr
Ramakrishna Kakarala
Omnivision Technologies, Inc., USA, ram.kakarala@ovt.com
Prem Kalra
Indian Institute of Technology, Delhi, India, pkalra@cse.iitd.ernet.in
Daniel Keim
University of Konstanz, Germany, keim@uni-konstanz.de
Jinman Kim
University of Sydney, Australia, jinman.kim@sydney.edu.au
George Alex Koulieris
Durham University, UK, georgios.a.koulieris@durham.ac.uk
Walter Kropatsch
Vienna University of Technology, Austria, krw@prip.tuwien.ac.at
Arjan Kuijper
Fraunhofer IGD & TU Darmstadt, Germany, arjan.kuijper@igd.fraunhofer.de
Yu-Kun Lai
Cardiff University, UK, LaiY4@cardiff.ac.uk
Jean-François Lalonde
Université Laval, Canada, jean-francois.lalonde@gel.ulaval.ca
Guanbin Li
Sun Yat-sen University, China, liguanbin@mail.sysu.edu.cn
Zechao Li
Nanjing University of Science and Technology, zechao.li@njust.edu.cn
Xiaodan Liang
Sun Yat-sen University, China, xdliang328@gmail.com
Di Lin
Shenzhen University, China, ande.lin1988@gmail.com
Ligang Liu
University of Science and Technology of China, lgliu@ustc.edu.cn
Risheng Liu
Dalian University of Technology, China, rsliu@dlut.edu.cn
Xuequan Lu
Deakin University, Australia, xuequan.lu@deakin.edu.au
Yong Luo
Wuhan University, China, luoyong@whu.edu.cn
Bingpeng Ma
University of Chinese Academy of Sciences, China, bpma@ucas.ac.cn
Luca Magri
Politecnico di Milano, Italy, luca.magri@polimi.it
Xiaoyang Mao
University of Yamanashi, Japan, mao@yamanashi.ac.jp
Iacopo Masi
Sapienza, University of Rome, Italy, masi@di.uniroma1.it
Stefano Mattoccia
University of Bologna, Italy, stefano.mattoccia@unibo.it
Fanman Meng
University of Electronic Science and Technology of China, fmmeng@uestc.edu.cn
Jingjing Meng
University at Buffalo, the State University of New York, USA, jingjing.meng1@gmail.com
Bochang Moon
Gwangju Institute of Science and Technology, Republic of Korea, moonbochang@gmail.com
Michela Mortara
IMATI-CNR Genova, Italy, michela.mortara@ge.imati.cnr.it
Anirban Mukhopadhyay
Technische Universität Darmstadt, Germany, anirban.mukhopadhyay@gris.informatik.tu-darmstadt.de
Ahmad H. Nasri
Lebanese National Council for Scientific Research, Lebanon, anasri.82@gmail.com
Luciana Porcher Nedel
Universidade Federal do Rio Grande do Sul, Porto Alegre, Brazil, nedel@inf.ufrgs.br
Tae-Hyun Oh
POSTECH, Republic of Korea, taehyun@postech.ac.kr
Victor Ostromoukhov
Claude Bernard University of Lyon 1, France, victor.ostromoukhov@liris.cnrs.fr
Jinshan Pan
Nanjing University of Science and Technology, China, sdluran@gmail.com
George Papagiannakis
University of Crete, Greece, papagian@ics.forth.gr
Chunlei Peng
Xidian University, China, clpeng@xidian.edu.cn
Xi Peng
Sichuan University, China, pengxi@scu.edu.cn
Andrea Prati
Università degli Studi di Parma, Italy, andrea.prati@unipr.it
Jianjun Qian
Nanjing University of Science and Technology (NUST), China, csjqian@njust.edu.cn
Jianfeng Ren
University of Nottingham Ningbo China, Jianfeng.Ren@nottingham.edu.cn
Zhou Ren
Wormpex AI Research, USA, renzhou200622@gmail.com
Jonathan Roberts
Bangor University, UK, j.c.roberts@bangor.ac.uk
Robert Sablatnig
Wien Technical University, Austria, sab@cvl.tuwien.ac.at
Filip Sadlo
University of Heidelberg, Germany, sadlo@uni-heidelberg.de
Yusuf Sahillioğlu
Middle East Technical University, Turkey, ys@ceng.metu.edu.tr
Gerik Scheuermann
University of Leipzig, Germany, scheuer@informatik.uni-leipzig.de
Thomas Schultz
University of Bonn, Germany, schultz@cs.uni-bonn.de
Hyewon Seo
CNRS and University of Strasbourg, France, seo@unistra.fr
Tianjia Shao
Zhejiang University, China, tjshao@zju.edu.cn
Bin Sheng
Shanghai Jiao Tong University, China, shengbin@cs.sjtu.edu.cn
Xiangbo Shu
Nanjing University of Science and Technology, China, shuxb@njust.edu.cn
Leonid Sigal
University of British Columbia, Canada, lsigal@cs.ubc.ca
Oh-young Song
Sejong University, Seoul, Republic of Korea, oysong@sejong.ac.kr
Alexei Sourin
Nanyang Technological University, Singapore, assourin@ntu.edu.sg
Michela Spagnuolo
IMATI-CNR, Genova, Italy, michela.spagnuolo@ge.imati.cnr.it
Xian Sun
Chinese Academy of Sciences, China, sunxian@aircas.ac.cn
Jinhui Tang
Nanjing University of Science and Technology, China, jinhuitang@njust.edu.cn
Daniel Thalmann
EPFL, Switzerland, daniel.thalmann@epfl.ch
Bernie Tiddeman
Aberystwyth University, UK, bpt@aber.ac.uk
Zhigang Tu
Wuhan University, China, tuzhigang@whu.edu.cn
Hongcheng Wang
Comcast Labs, USA, Hongcheng.Wang@gmail.com
Huamin Wang
The Ohio State University, USA, whmin@cse.ohio-state.edu
Keze Wang
DMAI Co., Ltd, China, kezewang@gmail.com
Weiming Wang
Hong Kong Metropolitan University, wmwang@hkmu.edu.hk
Mingqiang Wei
Nanjing University of Aeronautics and Astronautics, China, mqwei@nuaa.edu.cn
Franz-Erich Wolter
Leibniz Universität Hannover, Germany, few@gdv.uni-hannover.de
Tien-Tsin Wong
Chinese University of Hong Kong, ttwong@cse.cuhk.edu.hk
Chunlin Wu
Nankai University, China, wucl@nankai.edu.cn
Kevin Xu
National University of Defense Technology (NUDT), China, kevin.kai.xu@gmail.com
Kun Xu
Tsinghua University, China, xukun@tsinghua.edu.cn
Dongmin Yan
Chinese Academy of Sciences, China, yandongming@gmail.com
Wankou Yang
Southeast University, China, wkyang@seu.edu.cn
Xi Yang
Xidian University, China, yangx@xidian.edu.cn
Yücel Yemez
Koç University, Turkey, YYEMEZ@ku.edu.tr
Junsong Yuan
University of Buffalo, USA, jsyuan@buffalo.edu
Shanxin Yuan
Huawei Technologies Research & Development (UK) Ltd, shanxinyuan@gmail.com
Gabriel Zachmann
University of Bremen, Germany, zach@cs.uni-bremen.de
Pietro Zanuttigh
University of Padova, Italy, zanuttigh@dei.unipd.it
Dingwen Zhang
Northwestern Polytechnical University, China, zdw2006yyy@nwpu.edu.cn
Hua Zhang
Chinese Academy of Sciences, China, zhanghua@iie.ac.cn
Jian J Zhang
Bournemouth University, UK, jzhang@bournemouth.ac.uk
Kaibing Zhang
Xi’an Polytechnic University, China, zhangkaibing@xpu.edu.cn
Kang Zhang
University of Texas at Dallas, USA, kzhang@utdallas.edu
Lei Zhang
Beijing Institute of Technology, China, leizhang@bit.edu.cn
Mingjin Zhang
Xidian University, China, mjinzhang@xidian.edu.cn
Qianni Zhang
Queen Mary University of London, UK, qianni.zhang@qmul.ac.uk
Jianmin Zheng
Nanyang Technological University, Singapore, ASJMZheng@ntu.edu.sg
Wenming Zheng
Southeast University, China, wenming_zheng@seu.edu.cn
Youyi Zheng
Zhejiang University, China, youyizheng@zju.edu.cn
Shuaifeng Zhi
National University of Defense Technology (NUDT), China, zhishuaifeng11@nudt.edu.cn
Hongyuan Zhu
Institute for Infocomm Research, A*STAR, Singapore, zhuh@i2r.a-star.edu.sg
Changqing Zou
Zhejiang University, China, aaronzou1125@gmail.com
Wangmeng Zuo
Harbin Institute of Technology, China, wmzuo@hit.edu.cn
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