Editors
Editor-in-Chief
Nadia Magnenat-Thalmann
MIRALab-CUI
University of Geneva
Battelle, Building A
7, Route de Drize
CH-1227 Carouge, Geneva, Switzerland
thalmann@miralab.ch
http://www.miralab.ch/
Founding Editor
Tosiyasu L. Kunii
Editorial Board
Neeharika Adabala
CybULab, Bangalore, India, neeharik@gmail.com
Yagiz Aksoy
Simon Fraser University, Canada, yagiz@sfu.ca
Daniel G. Aliaga
Purdue University, USA, aliaga@cs.purdue.edu
Yiannis Aloimonos
University of Maryland, College Park, USA, yiannis@cs.umd.edu
Andreas Aristidou
University of Cyprus, a.aristidou@ieee.org
Selim Balcisoy
Sabanci University, Istanbul, Turkey, balcisoy@sabanciuniv.edu
Sebastiano Battiato
University of Catania, Italy, battiato@dmi.unict.it
Nicolas Bonneel
CNRS/Univ. Lyon, France, nicolas.bonneel@liris.cnrs.fr
Adrien Bousseau
Inria, Université Côte d’Azur, France, adrien.bousseau@inria.fr
Katja Bühler
VRVis Zentrum für Virtual Reality und Visualisierung Forschungs, Austria, buehler@vrvis.at
Benjamin Bustos
University of Chile, bebustos@dcc.uchile.cl
Yiyu Cai
Nanyang Technological University, Singapore, myycai@ntu.edu.sg
Tolga Çapın
TED University, Turkey, tolga.capin@tedu.edu.tr
Anirban Chakraborty
Indian Institute of Science, Bangalore, India, anirban@iisc.ac.in
Lap-Pui Chau
Nanyang Technological University, Singapore, elpchau@ntu.edu.sg
Falai Chen
University of Science and Technology of China, chenfl@ustc.edu.cn
Jie Chen
Hong Kong Baptist University, chenjie@comp.hkbu.edu.hk
Jie Chen
University of Oulu, Finland, jiechen2054@gmail.com
Renjie Chen
Max-Planck Institute for Informatics, Germany, renjie.chen@mpi-inf.mpg.de
David Coeurjolly
Laboratoire LIRIS, France, david.coeurjolly@liris.cnrs.fr
Frederic Cordier
University of Haute Alsace and University of Strasbourg, France, Frederic.Cordier@uha.fr
Massimiliano Corsini
University of Modena and Reggio Emilia, Italy, massimiliano.corsini@unimore.it
Rémi Cozot
LISIC, France, remi.cozot@univ-littoral.fr
Zhaopeng Cui
ETH Zurich, Switzerland, zhpcui@gmail.com
Naser Damer
Fraunhofer IGD, Germany, Naser.Damer@igd.fraunhofer.de
Jean-Michel Dischler
University of Strasbourg, France, dischler@unistra.fr
Parris K. Egbert
Brigham Young University, USA, egbert@cs.byu.edu
Jan Egger
Graz University of Technology, and Medical University of Graz, Austria, egger@tugraz.at
Petros Faloutsos
York University, Canada, pfal@cse.yorku.ca
Bin Fan
University of Science and Technology Beijing, China, bin.fan@ieee.org
Cornelia Fermuller
University of Maryland, USA, fer@umiacs.umd.edu
Xifeng Gao
Florida State University, USA, gxf.xisha@gmail.com
Christoph Garth
Technische Universität Kaiserslautern, Germany, garth@cs.uni-kl.de
Marina Gavrilova
University of Calgary, Canada, mgavrilo@ucalgary.ca
Enrico Gobbetti
The Center for Advanced Studies, Research and Development in Sardinia, Italy, gobbetti@crs4.it
Marcin Grzegorzek
Universität zu Lübeck, Germany, grzegorzek@imi.uni-luebeck.de
Shuhang Gu
ETH Zurich, Switzerland, shuhanggu@gmail.com
Frank Guan
Singapore Institute of Technology, frank.guan@singaporetech.edu.sg
Zhenhua Guo
Alibaba Group, China, cszguo@gmail.com
Junhui Hou
City University of Hong Kong, jh.hou@cityu.edu.hk
Ruizhen Hu
Shenzhen University, China, ruizhen.hu@gmail.com
Hua Huang
Beijing Institute of Technology, China, huahuang@bit.edu.cn
Dakai Jin
PAII Inc., USA, dakai.jin@gmail.com
Ramakrishna Kakarala
Omnivision Technologies, Inc., USA, ram.kakarala@ovt.com
Prem Kalra
Indian Institute of Technology, Delhi, India, pkalra@cse.iitd.ernet.in
Daniel Keim
University of Konstanz, Germany, keim@uni-konstanz.de
HyungSeok Kim
Konkuk University, South Korea, hyuskim@konkuk.ac.kr
Jinman Kim
University of Sydney, Australia, jinman.kim@sydney.edu.au
George Alex Koulieris
Durham University, UK, georgios.a.koulieris@durham.ac.uk
Walter Kropatsch
Vienna University of Technology, Austria, krw@prip.tuwien.ac.at
Arjan Kuijper
Fraunhofer IGD & TU Darmstadt, Germany, arjan.kuijper@igd.fraunhofer.de
Matthew Kyan
University of York, Canada, mkyan@cse.yorku.ca
Yu-Kun Lai
Cardiff University, UK, LaiY4@cardiff.ac.uk
Jean-François Lalonde
Université Laval, Canada, jean-francois.lalonde@gel.ulaval.ca
Seungyong Lee
Pohang University of Science & Technology (POSTECH), South Korea, leesy@postech.ac.kr
Bruno Levy
INRIA, France, Bruno.Levy@inria.fr
Guanbin Li
Sun Yat-sen University, China, liguanbin@mail.sysu.edu.cn
Xiaodan Liang
Sun Yat-sen University, China, xdliang328@gmail.com
Jing Liao
City University of Hong Kong, jingliao@cityu.edu.hk
Di Lin
Shenzhen University, China, ande.lin1988@gmail.com
Liang Lin
Sun Yat-sen University, Guangzhou, China, linliang@ieee.org
Li Liu
National University of Defense Technology, China, liuli_nudt@nudt.edu.cn
Ligang Liu
University of Science and Technology of China, lgliu@ustc.edu.cn
Risheng Liu
Dalian University of Technology, China, rsliu@dlut.edu.cn
Xiaoyang Mao
University of Yamanashi, Japan, mao@yamanashi.ac.jp
Iacopo Masi
University of Southern California (USC), USA, iacopoma@usc.edu
Stefano Mattoccia
University of Bologna, Italy, stefano.mattoccia@unibo.it
Fanman Meng
University of Electronic Science and Technology of China, fmmeng@uestc.edu.cn
Jingjing Meng
University at Buffalo, the State University of New York, USA, jingjing.meng1@gmail.com
Bochang Moon
Gwangju Institute of Science and Technology, South Korea, moonbochang@gmail.com
Anirban Mukhopadhyay
Technische Universität Darmstadt, Germany, anirban.mukhopadhyay@gris.informatik.tu-darmstadt.de
Masayuki Nakajima
Uppsala University, Sweden, nakajima.masayuki@gmail.com
Ahmad H. Nasri
Lebanese National Council for Scientific Research, Lebanon, anasri.82@gmail.com
Luciana Porcher Nedel
Universidade Federal do Rio Grande do Sul, Porto Alegre, Brazil, nedel@inf.ufrgs.br
Tae-Hyun Oh
POSTECH, South Korea, taehyun@postech.ac.kr
Victor Ostromoukhov
Claude Bernard University of Lyon 1, France, victor.ostromoukhov@liris.cnrs.fr
Jinshan Pan
Nanjing University of Science and Technology, China, sdluran@gmail.com
George Papagiannakis
University of Crete, Greece, papagian@ics.forth.gr
Xi Peng
Sichuan University, China, pengxi@scu.edu.cn
Beatriz Remeseiro
University of Oviedo, Spain, bremeseiro@uniovi.es
Zhou Ren
Snap Inc., USA, renzhou200622@gmail.com
Bodo Rosenhahn
Leibniz Universität Hannover, Germany, rosenhahn@tnt.uni-hannover.de
Jarek Rossignac
Georgia Institute of Technology, Atlanta, USA, jarek@cc.gatech.edu
Robert Sablatnig
Wien Technical University, Austria, sab@cvl.tuwien.ac.at
Filip Sadlo
University of Heidelberg, Germany, sadlo@uni-heidelberg.de
Yusuf Sahillioğlu
Middle East Technical University, Turkey, ys@ceng.metu.edu.tr
Gerik Scheuermann
University of Leipzig, Germany, scheuer@informatik.uni-leipzig.de
Thomas Schultz
University of Bonn, Germany, schultz@cs.uni-bonn.de
Hyewon Seo
CNRS and University of Strasbourg, France, seo@unistra.fr
Tianjia Shao
Zhejiang University, China, tjshao@zju.edu.cn
Jianbing Shen
Beijing Institute of Technology, China, shenjianbingcg@gmail.com
Bin Sheng
Shanghai Jiao Tong University, China, shengbin@cs.sjtu.edu.cn
Leonid Sigal
University of British Columbia, Canada, lsigal@cs.ubc.ca
Claudio T. Silva
Polytechnic Institute of New York University, USA, csilva@nyu.edu
Gregory G. Slabaugh
Queen Mary University of London, UK, g.slabaugh@qmul.ac.uk
Oh-young Song
Sejong University, Seoul, South Korea, oysong@sejong.ac.kr
Alexei Sourin
Nanyang Technological University, Singapore, assourin@ntu.edu.sg
Michela Spagnuolo
IMATI-CNR, Genova, Italy, michela.spagnuolo@ge.imati.cnr.it
Yu-Wing Tai
SenseTime Group Limited, Hong Kong, yuwing@sensetime.com
Jinhui Tang
Nanjing University of Science and Technology, China, jinhuitang@njust.edu.cn
Daniel Thalmann
EPFL, Switzerland, daniel.thalmann@epfl.ch
Zhigang Tu
Wuhan University, China, tuzhigang@whu.edu.cn
Nobuyuki Umetani
The University of Tokyo, Japan, n.umetani@gmail.com
Amir Vaxman
Utrecht University, The Netherlands, a.vaxman@uu.nl
Anne Verroust-Blondet
INRIA Paris, France, Anne.Verroust@inria.fr
Hongcheng Wang
Comcast Labs, USA, Hongcheng.Wang@gmail.com
Huamin Wang
The Ohio State University, USA, whmin@cse.ohio-state.edu
Keze Wang
DMAI Co., Ltd, China, kezewang@gmail.com
Nannan Wang
Xidian University, China, nnwang@xidian.edu.cn
Ruiping Wang
Chinese Academy of Sciences, China, wangruiping@ict.ac.cn
Franz-Erich Wolter
Leibniz Universität Hannover, Germany, few@gdv.uni-hannover.de
Tien-Tsin Wong
Chinese University of Hong Kong, ttwong@cse.cuhk.edu.hk
Chunlin Wu
Nankai University, China, wucl@nankai.edu.cn
Dan Xu
Hong Kong University of Science and Technology (HKUST), danxu@cse.ust.hk
Kevin Xu
National University of Defense Technology (NUDT), China, kevin.kai.xu@gmail.com
Kun Xu
Tsinghua University, China, xukun@tsinghua.edu.cn
Dongmin Yan
Chinese Academy of Sciences, China, yandongming@gmail.com
Qixiang Ye
University of Chinese Academy of Sciences, China, qxye@ucas.ac.cn
Yücel Yemez
Koç University, Turkey, YYEMEZ@ku.edu.tr
Quanzeng You
Microsoft Azure & AI, USA, quyou@microsoft.com
Junsong Yuan
University of Buffalo, USA, jsyuan@buffalo.edu
Pietro Zanuttigh
University of Padova, Italy, zanuttigh@dei.unipd.it
Kang Zhang
University of Texas at Dallas, USA, kzhang@utdallas.edu
Jian J Zhang
Bournemouth University, Dorset, UK, jzhang@bournemouth.ac.uk
Juyong Zhang
University of Science and Technology of China, juyong@ustc.edu.cn
Lei Zhang
Beijing Institute of Technology, China, leizhang@bit.edu.cn
Jianmin Zheng
Nanyang Technological University, Singapore, ASJMZheng@ntu.edu.sg
Liang Zheng
Australian National University, Australia, Liang.zheng@anu.edu.au
Wenming Zheng
Southeast University, China, wenming_zheng@seu.edu.cn
Youyi Zheng
Zhejiang University, China, youyizheng@zju.edu.cn
Hongyuan Zhu
Institute for Infocomm Research, A*STAR, Singapore, zhuh@i2r.a-star.edu.sg
Wangmeng Zuo
Harbin Institute of Technology, China, wmzuo@hit.edu.cn
Nadia Magnenat-Thalmann
MIRALab-CUI
University of Geneva
Battelle, Building A
7, Route de Drize
CH-1227 Carouge, Geneva, Switzerland
thalmann@miralab.ch
http://www.miralab.ch/
Founding Editor
Tosiyasu L. Kunii
Editorial Board
Neeharika Adabala
CybULab, Bangalore, India, neeharik@gmail.com
Yagiz Aksoy
Simon Fraser University, Canada, yagiz@sfu.ca
Daniel G. Aliaga
Purdue University, USA, aliaga@cs.purdue.edu
Yiannis Aloimonos
University of Maryland, College Park, USA, yiannis@cs.umd.edu
Andreas Aristidou
University of Cyprus, a.aristidou@ieee.org
Selim Balcisoy
Sabanci University, Istanbul, Turkey, balcisoy@sabanciuniv.edu
Sebastiano Battiato
University of Catania, Italy, battiato@dmi.unict.it
Nicolas Bonneel
CNRS/Univ. Lyon, France, nicolas.bonneel@liris.cnrs.fr
Adrien Bousseau
Inria, Université Côte d’Azur, France, adrien.bousseau@inria.fr
Katja Bühler
VRVis Zentrum für Virtual Reality und Visualisierung Forschungs, Austria, buehler@vrvis.at
Benjamin Bustos
University of Chile, bebustos@dcc.uchile.cl
Yiyu Cai
Nanyang Technological University, Singapore, myycai@ntu.edu.sg
Tolga Çapın
TED University, Turkey, tolga.capin@tedu.edu.tr
Anirban Chakraborty
Indian Institute of Science, Bangalore, India, anirban@iisc.ac.in
Lap-Pui Chau
Nanyang Technological University, Singapore, elpchau@ntu.edu.sg
Falai Chen
University of Science and Technology of China, chenfl@ustc.edu.cn
Jie Chen
Hong Kong Baptist University, chenjie@comp.hkbu.edu.hk
Jie Chen
University of Oulu, Finland, jiechen2054@gmail.com
Renjie Chen
Max-Planck Institute for Informatics, Germany, renjie.chen@mpi-inf.mpg.de
David Coeurjolly
Laboratoire LIRIS, France, david.coeurjolly@liris.cnrs.fr
Frederic Cordier
University of Haute Alsace and University of Strasbourg, France, Frederic.Cordier@uha.fr
Massimiliano Corsini
University of Modena and Reggio Emilia, Italy, massimiliano.corsini@unimore.it
Rémi Cozot
LISIC, France, remi.cozot@univ-littoral.fr
Zhaopeng Cui
ETH Zurich, Switzerland, zhpcui@gmail.com
Naser Damer
Fraunhofer IGD, Germany, Naser.Damer@igd.fraunhofer.de
Jean-Michel Dischler
University of Strasbourg, France, dischler@unistra.fr
Parris K. Egbert
Brigham Young University, USA, egbert@cs.byu.edu
Jan Egger
Graz University of Technology, and Medical University of Graz, Austria, egger@tugraz.at
Petros Faloutsos
York University, Canada, pfal@cse.yorku.ca
Bin Fan
University of Science and Technology Beijing, China, bin.fan@ieee.org
Cornelia Fermuller
University of Maryland, USA, fer@umiacs.umd.edu
Xifeng Gao
Florida State University, USA, gxf.xisha@gmail.com
Christoph Garth
Technische Universität Kaiserslautern, Germany, garth@cs.uni-kl.de
Marina Gavrilova
University of Calgary, Canada, mgavrilo@ucalgary.ca
Enrico Gobbetti
The Center for Advanced Studies, Research and Development in Sardinia, Italy, gobbetti@crs4.it
Marcin Grzegorzek
Universität zu Lübeck, Germany, grzegorzek@imi.uni-luebeck.de
Shuhang Gu
ETH Zurich, Switzerland, shuhanggu@gmail.com
Frank Guan
Singapore Institute of Technology, frank.guan@singaporetech.edu.sg
Zhenhua Guo
Alibaba Group, China, cszguo@gmail.com
Junhui Hou
City University of Hong Kong, jh.hou@cityu.edu.hk
Ruizhen Hu
Shenzhen University, China, ruizhen.hu@gmail.com
Hua Huang
Beijing Institute of Technology, China, huahuang@bit.edu.cn
Dakai Jin
PAII Inc., USA, dakai.jin@gmail.com
Ramakrishna Kakarala
Omnivision Technologies, Inc., USA, ram.kakarala@ovt.com
Prem Kalra
Indian Institute of Technology, Delhi, India, pkalra@cse.iitd.ernet.in
Daniel Keim
University of Konstanz, Germany, keim@uni-konstanz.de
HyungSeok Kim
Konkuk University, South Korea, hyuskim@konkuk.ac.kr
Jinman Kim
University of Sydney, Australia, jinman.kim@sydney.edu.au
George Alex Koulieris
Durham University, UK, georgios.a.koulieris@durham.ac.uk
Walter Kropatsch
Vienna University of Technology, Austria, krw@prip.tuwien.ac.at
Arjan Kuijper
Fraunhofer IGD & TU Darmstadt, Germany, arjan.kuijper@igd.fraunhofer.de
Matthew Kyan
University of York, Canada, mkyan@cse.yorku.ca
Yu-Kun Lai
Cardiff University, UK, LaiY4@cardiff.ac.uk
Jean-François Lalonde
Université Laval, Canada, jean-francois.lalonde@gel.ulaval.ca
Seungyong Lee
Pohang University of Science & Technology (POSTECH), South Korea, leesy@postech.ac.kr
Bruno Levy
INRIA, France, Bruno.Levy@inria.fr
Guanbin Li
Sun Yat-sen University, China, liguanbin@mail.sysu.edu.cn
Xiaodan Liang
Sun Yat-sen University, China, xdliang328@gmail.com
Jing Liao
City University of Hong Kong, jingliao@cityu.edu.hk
Di Lin
Shenzhen University, China, ande.lin1988@gmail.com
Liang Lin
Sun Yat-sen University, Guangzhou, China, linliang@ieee.org
Li Liu
National University of Defense Technology, China, liuli_nudt@nudt.edu.cn
Ligang Liu
University of Science and Technology of China, lgliu@ustc.edu.cn
Risheng Liu
Dalian University of Technology, China, rsliu@dlut.edu.cn
Xiaoyang Mao
University of Yamanashi, Japan, mao@yamanashi.ac.jp
Iacopo Masi
University of Southern California (USC), USA, iacopoma@usc.edu
Stefano Mattoccia
University of Bologna, Italy, stefano.mattoccia@unibo.it
Fanman Meng
University of Electronic Science and Technology of China, fmmeng@uestc.edu.cn
Jingjing Meng
University at Buffalo, the State University of New York, USA, jingjing.meng1@gmail.com
Bochang Moon
Gwangju Institute of Science and Technology, South Korea, moonbochang@gmail.com
Anirban Mukhopadhyay
Technische Universität Darmstadt, Germany, anirban.mukhopadhyay@gris.informatik.tu-darmstadt.de
Masayuki Nakajima
Uppsala University, Sweden, nakajima.masayuki@gmail.com
Ahmad H. Nasri
Lebanese National Council for Scientific Research, Lebanon, anasri.82@gmail.com
Luciana Porcher Nedel
Universidade Federal do Rio Grande do Sul, Porto Alegre, Brazil, nedel@inf.ufrgs.br
Tae-Hyun Oh
POSTECH, South Korea, taehyun@postech.ac.kr
Victor Ostromoukhov
Claude Bernard University of Lyon 1, France, victor.ostromoukhov@liris.cnrs.fr
Jinshan Pan
Nanjing University of Science and Technology, China, sdluran@gmail.com
George Papagiannakis
University of Crete, Greece, papagian@ics.forth.gr
Xi Peng
Sichuan University, China, pengxi@scu.edu.cn
Beatriz Remeseiro
University of Oviedo, Spain, bremeseiro@uniovi.es
Zhou Ren
Snap Inc., USA, renzhou200622@gmail.com
Bodo Rosenhahn
Leibniz Universität Hannover, Germany, rosenhahn@tnt.uni-hannover.de
Jarek Rossignac
Georgia Institute of Technology, Atlanta, USA, jarek@cc.gatech.edu
Robert Sablatnig
Wien Technical University, Austria, sab@cvl.tuwien.ac.at
Filip Sadlo
University of Heidelberg, Germany, sadlo@uni-heidelberg.de
Yusuf Sahillioğlu
Middle East Technical University, Turkey, ys@ceng.metu.edu.tr
Gerik Scheuermann
University of Leipzig, Germany, scheuer@informatik.uni-leipzig.de
Thomas Schultz
University of Bonn, Germany, schultz@cs.uni-bonn.de
Hyewon Seo
CNRS and University of Strasbourg, France, seo@unistra.fr
Tianjia Shao
Zhejiang University, China, tjshao@zju.edu.cn
Jianbing Shen
Beijing Institute of Technology, China, shenjianbingcg@gmail.com
Bin Sheng
Shanghai Jiao Tong University, China, shengbin@cs.sjtu.edu.cn
Leonid Sigal
University of British Columbia, Canada, lsigal@cs.ubc.ca
Claudio T. Silva
Polytechnic Institute of New York University, USA, csilva@nyu.edu
Gregory G. Slabaugh
Queen Mary University of London, UK, g.slabaugh@qmul.ac.uk
Oh-young Song
Sejong University, Seoul, South Korea, oysong@sejong.ac.kr
Alexei Sourin
Nanyang Technological University, Singapore, assourin@ntu.edu.sg
Michela Spagnuolo
IMATI-CNR, Genova, Italy, michela.spagnuolo@ge.imati.cnr.it
Yu-Wing Tai
SenseTime Group Limited, Hong Kong, yuwing@sensetime.com
Jinhui Tang
Nanjing University of Science and Technology, China, jinhuitang@njust.edu.cn
Daniel Thalmann
EPFL, Switzerland, daniel.thalmann@epfl.ch
Zhigang Tu
Wuhan University, China, tuzhigang@whu.edu.cn
Nobuyuki Umetani
The University of Tokyo, Japan, n.umetani@gmail.com
Amir Vaxman
Utrecht University, The Netherlands, a.vaxman@uu.nl
Anne Verroust-Blondet
INRIA Paris, France, Anne.Verroust@inria.fr
Hongcheng Wang
Comcast Labs, USA, Hongcheng.Wang@gmail.com
Huamin Wang
The Ohio State University, USA, whmin@cse.ohio-state.edu
Keze Wang
DMAI Co., Ltd, China, kezewang@gmail.com
Nannan Wang
Xidian University, China, nnwang@xidian.edu.cn
Ruiping Wang
Chinese Academy of Sciences, China, wangruiping@ict.ac.cn
Franz-Erich Wolter
Leibniz Universität Hannover, Germany, few@gdv.uni-hannover.de
Tien-Tsin Wong
Chinese University of Hong Kong, ttwong@cse.cuhk.edu.hk
Chunlin Wu
Nankai University, China, wucl@nankai.edu.cn
Dan Xu
Hong Kong University of Science and Technology (HKUST), danxu@cse.ust.hk
Kevin Xu
National University of Defense Technology (NUDT), China, kevin.kai.xu@gmail.com
Kun Xu
Tsinghua University, China, xukun@tsinghua.edu.cn
Dongmin Yan
Chinese Academy of Sciences, China, yandongming@gmail.com
Qixiang Ye
University of Chinese Academy of Sciences, China, qxye@ucas.ac.cn
Yücel Yemez
Koç University, Turkey, YYEMEZ@ku.edu.tr
Quanzeng You
Microsoft Azure & AI, USA, quyou@microsoft.com
Junsong Yuan
University of Buffalo, USA, jsyuan@buffalo.edu
Pietro Zanuttigh
University of Padova, Italy, zanuttigh@dei.unipd.it
Kang Zhang
University of Texas at Dallas, USA, kzhang@utdallas.edu
Jian J Zhang
Bournemouth University, Dorset, UK, jzhang@bournemouth.ac.uk
Juyong Zhang
University of Science and Technology of China, juyong@ustc.edu.cn
Lei Zhang
Beijing Institute of Technology, China, leizhang@bit.edu.cn
Jianmin Zheng
Nanyang Technological University, Singapore, ASJMZheng@ntu.edu.sg
Liang Zheng
Australian National University, Australia, Liang.zheng@anu.edu.au
Wenming Zheng
Southeast University, China, wenming_zheng@seu.edu.cn
Youyi Zheng
Zhejiang University, China, youyizheng@zju.edu.cn
Hongyuan Zhu
Institute for Infocomm Research, A*STAR, Singapore, zhuh@i2r.a-star.edu.sg
Wangmeng Zuo
Harbin Institute of Technology, China, wmzuo@hit.edu.cn
