Building Simulation: An International Journal solicits papers for a topical issue on Thermal Environment for Special Space and/or Special Population

Dear Colleagues,

Thermal environment is one of the most important indoor factors that affect thermal comfort, work performance, well-being and sleep quality of occupants. Over the last 30 years research on thermal comfort has undergone a dramatic intensification of activity. Many standards have been updated to design the thermal environment that could meet the requirements of thermal comfort. While different thermal environment should be designed for some special environments. For example, the current thermal comfort standards and practices in air conditioning may not be applicable for sleeping people. For some deep underground environment, dampness is one of the most serious problems to be solved and moisture condensation may even cause risks for safety production. There are relatively very few studies addressing the thermal environment of the above situations. Also we have limited knowledge about the thermal requirements of the elderly or the children, who are more vulnerable to the thermal environment. An increased understanding of thermal comfort for special population offers directions for innovations in the design of thermal environment.

To fill out the above knowledge gap in thermal environment, a topical issue, entitled “Thermal Environment for Special Space and/or Special Population”, was proposed for the prestigious journal Building Simulation, which is indexed in Science Citation Index and Scopus. This topical issue mainly covers original research studies, including, but not limited to the following topics:

  • Demand-response and smart technologies for special space and/or special population
  • Ergonomics of the built environment and the design of flexible spaces
  • Measuring and modeling of thermal environment
  • Thermal comfort
  • Health, human performance, and productivity in the built environment
  • Urban microclimate and thermal comfort outdoors

Papers selected for this topical issue are subject to a rigorous peer review procedure before being rapidly and widely disseminated.

We sincerely invite you to submit your original work to this topical issue and are looking forward to sharing your outstanding research outcomes with the peers around the world.

Paper submissions: When preparing your manuscript, please follow the Instructions for Authors of Building Simulation, which can be downloaded from the journal website (www.springer.com/journal/12273).

Submit your paper online at www.editorialmanager.com/buil and mark “Topical Issue on Thermal Environment for Special Space and/or Special Population” in your manuscript.

You can also download "Call for Papers_Thermal Environment for Special Space and/or Special Population".

Important Dates (extended):

Submission deadline of full papers: August 31, 2020

Completion of the first-round review: October 15, 2020

Submission deadline of revised papers: November 15, 2020

Final notification: December 15, 2020

Issue published: January 2021

Co-guest Editors:

Li Lan, Shanghai Jiao Tong University, China.

E-mail: lanli2006@sjtu.edu.cn

Chungyoon Chun, Yonsei University, South Korea.

E-mail: chun@yonsei.ac.kr

Editorial Office

www.springer.com/journal/12273

E-mail: bsjournal@tsinghua.edu.cn