Editors

Editor-in-Chief
Ursula R. Kattner, NIST, Materials Science & Engineering Division Gaithersburg, MD, USA

Associate Editors
Raymundo Arroyave, Texas A&M University, College Station, TX, USA; R.R. de Avillez, Pontificia Universidade Catolica do Riode Janeiro, Rio de Janeiro, Brazil; Irina Belova, The University of Newcastle, Callaghan, Australia; Carelyn E. Campbell, National Institute of Standards and Technology (NIST), Materials Science & Engineering Division, Gaithersburg, MD, USA; Yong Du, State Key Laboratory of Powder Metallurgy, Hunan, P.R. China; Hans Flandorfer, Universitaet Wien, Vienna, Austria; Michael C. Gao, National Energy Technology Laboratory, Albany, OR, USA; Wladyslaw Gasior, Polish Academy of Sciences, Krakow, Poland; K.C. Hari Kumar, Indian Institute of Technology Madras, Chennai, India; Andreas Leineweber, TU Bergakademie Freiberg, Freiberg, Germany; R.G. Reddy, The University of Alabama, Tuscaloosa, AL, USA; Peter Rogl, Universitaet Wien, Vienna, Austria; Rainer Schmid-Fetzer, Clausthal University of Technology, Clausthal-Zellerfield, Germany; Hans J. Seifert, Karlsruhe Institute of Technology, Eggenstein-Leopoldshafen, Germany; Yongho Sohn, University of Central Florida, Orlando, FL, USA; Andrew Watson, Hampton Thermodynamics, Hampton, United Kingdom; Wei Xiong, University of Pittsburgh, Pittsburgh, PA, USA; Fan Zhang, CompuTherm, LLC, Madison, WI, USA; Ji-Cheng Zhao, University of Maryland, College Park, MD, USA

Alloy Phase Diagram Committee
Michael C. Gao, Chair, National Energy Technology Laboratory, Albany, OR, USA; Richard Otis, Vice Chair, Jet Propulsion Laboratory, Covington, LA, USA; Chelsey Hargather, Secretary, New Mexico Institute of Mining and Technology, Socorro, NM, USA; Jeffrey C. LaCombe, Immediate Past Chair, Old Dominion University, Norfolk, VA, USA; Raymundo Arroyave, Texas A&M University, College Station, TX, USA; Andrew Bobel, General Motors, Troy, MI, USA; Carelyn E. Campbell, National Institute of Standards and Technology (NIST), Materials Science & Engineering Division, Gaithersburg, MD, USA; Shuanglin Chen, CompuTherm, LLC, Madison, WI, USA; Sinn-wen Chen, National Tsing Hua University, Taiwan; Yuwen Cui, Nanjing Tech University, Nanjing, China; In-Ho Jung, Seoul National University, Gwanak-gu Seoul, South Korea; Ursula Kattner, National Institute of Standards and Technology (NIST), Materials Science & Engineering Division, Gaithersburg, MD, USA; Ricardo Komai, Tesla, San Jose, CA, USA; Byeong-Joo Lee, Pohang University of Science and Technology (POSTECH), Pohang, Korea; Zhi Liang, QuesTek, Evanston, IL, USA; Greta Lindwall, KTH Royal Institute of Technology, Stockholm, Sweden; Zi-Kui Liu, Penn State University, University Park, PA, USA ; Alan Luo, The Ohio State University, Columbus, OH, USA; Paul K. Mason, Thermo Calc Software, Inc., McMurray, PA, USA; Emily E. Moore, Lawrence Livermore National Laboratory, PA, USA; Govindarajan Muralidharan, Oak Ridge National Laboratory, Knoxville, TN, USA; Ashley Paz y Puente, University of Cincinnati, Cincinnati, OH, USA; John Perepezko, University of Wisconsin-Madison, Madison, WI, USA; Aurelien Perron, Lawrence Livermore National Laboratory, Livermore, CA, USA; James E. Saal, Citrine Informatics, Honolulu, HI, USA; Rainer Schmid-Fetzer, Clausthal University of Technology, Clausthal-Zellerfeld, Germany; Hans Jurgen Seifert, Karlsruhe Institute of Technology, Eggenstein-Leopoldshafen, Germany; Dongwon Shin, Oak Ridge National Laboratory, Oak Ridge, TN, USA; Yongho Sohn, University of Central Florida, Orlando, FL, USA; Patrice E.A. Turchi, Lawrence Livermore National Laboratory (Retired), Livermore, CA, USA; Wei Xiong, University of Pittsburgh, Pittsburgh, PA, USA; Qiaofu Zhang, The University of Alabama, Tuscaloosa, AL, USA; Fan Zhang, Computherm LLC, Madison, WI, USA; Ji-Cheng Zhao, University of Maryland, College Park, MD, USA; Wei Zhong, QuesTek, Evanston, IL, USA; Yu Zhong, Worcester Polytechnic Institute, Worcester, MA, USA; Le Zhou, Marquette University, Milwaukee, WI, USA; Mary Anne Fleming, Staff Liaison, ASM International, Materials Park, OH, USA